YOICHI OYA

Person

CHIBA, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Printed circuit board and fabrication method thereof
- Patent number 7,192,801
- Issue date Mar 20, 2007
- Sony Corporation
- Yoichi Oya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board multi-layer structure with embedded device
- Patent number 6,949,836
- Issue date Sep 27, 2005
- Sony Corporation
- Yoichi Oya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High frequency module device and method for its preparation
- Patent number 6,797,890
- Issue date Sep 28, 2004
- Sony Corporation
- Akihiko Okubora
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High frequency module device and method for its preparation
- Patent number 6,714,422
- Issue date Mar 30, 2004
- Sony Corporation
- Akihiko Okubora
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package and mount board
- Patent number 6,469,393
- Issue date Oct 22, 2002
- Sony Corporation
- Yoichi Oya
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Inductor element and method for production thereof, and semiconduct...
- Publication number 20070247268
- Publication date Oct 25, 2007
- Yoichi Oya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of producing the same
- Publication number 20070040281
- Publication date Feb 22, 2007
- Hirokazu Nakayama
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Printed circuit board and fabrication method thereof
- Publication number 20050239236
- Publication date Oct 27, 2005
- Sony Corporation
- Yoichi Oya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed circuit board and fabrication method thereof
- Publication number 20040000710
- Publication date Jan 1, 2004
- Yoichi Oya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
High frequency module device and method for its preparation
- Publication number 20020195270
- Publication date Dec 26, 2002
- Akihiko Okubora
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High frequency module device and method for its preparation
- Publication number 20020075106
- Publication date Jun 20, 2002
- Akihiko Okubora
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package and mount board, and mounting method using th...
- Publication number 20020058356
- Publication date May 16, 2002
- YOICHI OYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MOUNT BOARD, AND MOUNTING METHOD USING TH...
- Publication number 20010054753
- Publication date Dec 27, 2001
- YOICHI OYA
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Printed circuit board and fabrication method thereof

Printed circuit board multi-layer structure with embedded device

High frequency module device and method for its preparation

High frequency module device and method for its preparation

Semiconductor package and mount board

Patents Applicationslast 30 patents

Inductor element and method for production thereof, and semiconduct...

Semiconductor device and method of producing the same

Printed circuit board and fabrication method thereof

Printed circuit board and fabrication method thereof

High frequency module device and method for its preparation

High frequency module device and method for its preparation

Semiconductor package and mount board, and mounting method using th...

SEMICONDUCTOR PACKAGE AND MOUNT BOARD, AND MOUNTING METHOD USING TH...