Yoji Kawakami

Follow

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Process and apparatus for forming ball bumps
- Patent number 5,857,610
- Issue date Jan 12, 1999
- Nippon Steel Corporation
- Hiroshi Hoshiba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process and apparatus for forming ball bumps
- Patent number 5,803,339
- Issue date Sep 8, 1998
- Nippon Steel Corporation
- Hiroshi Hoshiba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process and apparatus for forming ball bumps
- Patent number 5,687,901
- Issue date Nov 18, 1997
- Nippon Steel Corporation
- Hiroshi Hoshiba
- H01 - BASIC ELECTRIC ELEMENTS