Yoji Sawada

Person

Ogaki, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing wiring substrate
- Patent number 12,033,927
- Issue date Jul 9, 2024
- Ibiden Co., Ltd.
- Isao Ohno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate having metal post offset from conductor pad and me...
- Patent number 11,935,822
- Issue date Mar 19, 2024
- Ibiden Co., Ltd.
- Isao Ohno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate
- Patent number 11,749,596
- Issue date Sep 5, 2023
- Ibiden Co., Ltd.
- Katsuyuki Sano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed wiring board and method for manufacturing printed wiring board
- Patent number 11,678,440
- Issue date Jun 13, 2023
- Ibiden Co., Ltd.
- Yoji Sawada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate
- Patent number 11,622,446
- Issue date Apr 4, 2023
- Ibiden Co., Ltd.
- Isao Ohno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing printed wiring board
- Patent number 11,246,224
- Issue date Feb 8, 2022
- Ibiden Co., Ltd.
- Yoji Sawada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and method for manufacturing printed wiring board
- Patent number 11,222,791
- Issue date Jan 11, 2022
- Ibiden Co., Ltd.
- Yoji Sawada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed wiring board and method for manufacturing the same
- Patent number 11,019,732
- Issue date May 25, 2021
- Ibiden Co., Ltd.
- Yoji Sawada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board
- Patent number 10,804,191
- Issue date Oct 13, 2020
- Ibiden Co., Ltd.
- Hajime Sakamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed wiring board
- Patent number 10,636,741
- Issue date Apr 28, 2020
- Ibiden Co., Ltd.
- Yoji Sawada
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
WIRING SUBSTRATE
- Publication number 20220165653
- Publication date May 26, 2022
- IBIDEN CO., LTD.
- Katsuyuki SANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE
- Publication number 20220015234
- Publication date Jan 13, 2022
- IBIDEN CO., LTD.
- Isao OHNO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING WIRING SUBSTRATE
- Publication number 20220013409
- Publication date Jan 13, 2022
- IBIDEN CO., LTD.
- Isao OHNO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE AND METHOD FOR MANUFACTURING WIRING SUBSTRATE
- Publication number 20220013455
- Publication date Jan 13, 2022
- IBIDEN CO., LTD.
- Isao OHNO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE AND METHOD FOR MANUFACTURING WIRING SUBSTRATE
- Publication number 20220013448
- Publication date Jan 13, 2022
- IBIDEN CO., LTD.
- Isao OHNO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20210068265
- Publication date Mar 4, 2021
- IBIDEN CO., LTD.
- Yoji Sawada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING PRINTED WIRING BOARD
- Publication number 20210068264
- Publication date Mar 4, 2021
- IBIDEN CO., LTD.
- Yoji Sawada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
- Publication number 20200365418
- Publication date Nov 19, 2020
- IBIDEN CO., LTD.
- Yoji SAWADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
- Publication number 20200367368
- Publication date Nov 19, 2020
- IBIDEN CO., LTD.
- Yoji SAWADA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20190198446
- Publication date Jun 27, 2019
- IBIDEN CO., LTD.
- Yoji SAWADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20190109085
- Publication date Apr 11, 2019
- IBIDEN CO., LTD.
- Hajime Sakamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20190098752
- Publication date Mar 28, 2019
- IBIDEN CO., LTD.
- Hajime Sakamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Yoji Sawada

Person

Patents Grantslast 30 patents

Method for manufacturing wiring substrate

Wiring substrate having metal post offset from conductor pad and me...

Wiring substrate

Printed wiring board and method for manufacturing printed wiring board

Wiring substrate

Method for manufacturing printed wiring board

Printed wiring board and method for manufacturing printed wiring board

Printed wiring board and method for manufacturing the same

Printed wiring board

Printed wiring board

Patents Applicationslast 30 patents

WIRING SUBSTRATE

WIRING SUBSTRATE

METHOD FOR MANUFACTURING WIRING SUBSTRATE

WIRING SUBSTRATE AND METHOD FOR MANUFACTURING WIRING SUBSTRATE

WIRING SUBSTRATE AND METHOD FOR MANUFACTURING WIRING SUBSTRATE

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

METHOD FOR MANUFACTURING PRINTED WIRING BOARD

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD

PRINTED WIRING BOARD

PRINTED WIRING BOARD

PRINTED WIRING BOARD