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Singapore, SG
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last 30 patents
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Patent Grant
BOC BGA package for die with I-shaped bond pad layout
Patent number
7,112,048
Issue date
Sep 26, 2006
Micron Technology, Inc.
Thiam Chye Lim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
BOC BGA package for die with I-shaped bond pad layout
Patent number
6,720,666
Issue date
Apr 13, 2004
Micron Technology, Inc.
Thiam Chye Lim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
BOC BGA package for die with I-shaped bond pad layout
Patent number
6,692,987
Issue date
Feb 17, 2004
Micron Technology, Inc.
Thiam Chye Lim
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
BOC BGA package for die with I-shaped bond pad layout
Publication number
20030211659
Publication date
Nov 13, 2003
Micron Technology, Inc.
Thiam Chye Lim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BOC BGA package for die with I-shaped bond pad layout
Publication number
20030211660
Publication date
Nov 13, 2003
Micron Technology, Inc.
Thiam Chye Lim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BOC BGA package for die with I-shaped bond pad layout
Publication number
20030148557
Publication date
Aug 7, 2003
Thiam Chye Lim
H01 - BASIC ELECTRIC ELEMENTS