Yoko Mizuno

Follow

Person

Niigata, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Surface treatment solutions for gold and gold alloys
- Patent number 9,914,838
- Issue date Mar 13, 2018
- Rohm and Haas Electronic Materials LLC
- Yoko Mizuno
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electrolytic copper plating solution and method of electrolytic cop...
- Patent number 9,169,576
- Issue date Oct 27, 2015
- Rohm and Haas Electronic Materials LLC
- Mutsuko Saito
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electrolytic copper plating liquid and the electrolytic copper plat...
- Patent number 9,150,976
- Issue date Oct 6, 2015
- Rohm and Haas Electronic Materials LLC
- Mutsuko Saito
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
BARREL PLATING OR HIGH-SPEED ROTARY PLATING USING A NEUTRAL TIN PLA...
- Publication number 20180135195
- Publication date May 17, 2018
- Rohm and Haas Electronic Materials L.L.C.
- Makoto Kondo
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SURFACE TREATMENT SOLUTIONS FOR GOLD AND GOLD ALLOYS
- Publication number 20170002211
- Publication date Jan 5, 2017
- Rohm and Haas Electronic Materials L.L.C.
- Yoko Mizuno
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROLYTIC COPPER PLATING SOLUTION
- Publication number 20160186348
- Publication date Jun 30, 2016
- Rohm and Haas Electronic Materials L.L.C.
- Yoko Mizuno
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROLYTIC COPPER PLATING LIQUID AND THE ELECTROLYTIC COPPER PLAT...
- Publication number 20140097087
- Publication date Apr 10, 2014
- Mutsuko SAITO
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROLYTIC COPPER PLATING SOLUTION AND METHOD OF ELECTROLYTIC COP...
- Publication number 20130319867
- Publication date Dec 5, 2013
- Mutsuko SAITO
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR