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Yoko Nishino

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  • Tokyo, JP
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Patents Grantslast 30 patents

  • Information Patent Grant

    Wafer producing method
    • Patent number 10,369,659
    • Issue date Aug 6, 2019
    • Disco Corporation
    • Kazuya Hirata
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Wafer producing method
    • Patent number 10,357,851
    • Issue date Jul 23, 2019
    • Disco Corporation
    • Yoko Nishino
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Wafer thinning method
    • Patent number 10,319,593
    • Issue date Jun 11, 2019
    • Disco Corporation
    • Kazuya Hirata
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Water producing method
    • Patent number 10,297,438
    • Issue date May 21, 2019
    • Disco Corporation
    • Kazuya Hirata
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Wafer producing method
    • Patent number 10,081,076
    • Issue date Sep 25, 2018
    • Disco Corporation
    • Kazuya Hirata
    • C30 - CRYSTAL GROWTH
  • Information Patent Grant

    Wafer producing method
    • Patent number 10,076,804
    • Issue date Sep 18, 2018
    • Disco Corporation
    • Kazuya Hirata
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Wafer producing method
    • Patent number 9,925,619
    • Issue date Mar 27, 2018
    • Disco Corporation
    • Kazuya Hirata
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Wafer processing method
    • Patent number 9,899,262
    • Issue date Feb 20, 2018
    • Disco Corporation
    • Kazuya Hirata
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    SiC ingot slicing method
    • Patent number 9,884,389
    • Issue date Feb 6, 2018
    • Disco Corporation
    • Kazuya Hirata
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Wafer producing method
    • Patent number 9,884,390
    • Issue date Feb 6, 2018
    • Disco Corporation
    • Kazuya Hirata
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Polycrystalline SiC wafer producing method
    • Patent number 9,808,884
    • Issue date Nov 7, 2017
    • Disco Corporation
    • Kazuya Hirata
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Wafer producing method
    • Patent number 9,789,565
    • Issue date Oct 17, 2017
    • Disco Corporation
    • Kazuya Hirata
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Wafer producing method
    • Patent number 9,764,428
    • Issue date Sep 19, 2017
    • Disco Corporation
    • Kazuya Hirata
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Wafer producing method
    • Patent number 9,764,420
    • Issue date Sep 19, 2017
    • Disco Corporation
    • Kazuya Hirata
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Wafer processing method
    • Patent number 9,620,415
    • Issue date Apr 11, 2017
    • Disco Corporation
    • Kazuya Hirata
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Wafer producing method
    • Patent number 9,517,530
    • Issue date Dec 13, 2016
    • Disco Corporation
    • Kazuya Hirata
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Wafer producing method
    • Patent number 9,481,051
    • Issue date Nov 1, 2016
    • Disco Corporation
    • Kazuya Hirata
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Laser processing method and laser processing apparatus
    • Patent number 9,193,008
    • Issue date Nov 24, 2015
    • Disco Corporation
    • Hiroshi Morikazu
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Laser processing apparatus including plasma detecting means
    • Patent number 9,174,305
    • Issue date Nov 3, 2015
    • Disco Corporation
    • Hiroshi Morikazu
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Laser processing method for nonlinear crystal substrate
    • Patent number 9,174,306
    • Issue date Nov 3, 2015
    • Disco Corporation
    • Hiroshi Morikazu
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Optical device wafer processing method
    • Patent number 8,759,195
    • Issue date Jun 24, 2014
    • Disco Corporation
    • Hiroshi Morikazu
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

  • Information Patent Application

    WAFER PRODUCING METHOD
    • Publication number 20170348796
    • Publication date Dec 7, 2017
    • Disco Corporation
    • Yoko Nishino
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WAFER PROCESSING METHOD
    • Publication number 20170053831
    • Publication date Feb 23, 2017
    • Disco Corporation
    • Kazuya Hirata
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WAFER PROCESSING METHOD
    • Publication number 20170053829
    • Publication date Feb 23, 2017
    • Disco Corporation
    • Kazuya Hirata
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WAFER THINNING METHOD
    • Publication number 20170025275
    • Publication date Jan 26, 2017
    • Disco Corporation
    • Kazuya Hirata
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    POLYCRYSTALLINE SiC WAFER PRODUCING METHOD
    • Publication number 20170014944
    • Publication date Jan 19, 2017
    • Disco Corporation
    • Kazuya Hirata
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WAFER PRODUCING METHOD
    • Publication number 20160288250
    • Publication date Oct 6, 2016
    • Disco Corporation
    • Kazuya Hirata
    • B26 - HAND CUTTING TOOLS CUTTING SEVERING
  • Information Patent Application

    WAFER PRODUCING METHOD
    • Publication number 20160288251
    • Publication date Oct 6, 2016
    • Disco Corporation
    • Kazuya Hirata
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WAFER PRODUCING METHOD
    • Publication number 20160293397
    • Publication date Oct 6, 2016
    • Disco Corporation
    • Kazuya Hirata
    • C30 - CRYSTAL GROWTH
  • Information Patent Application

    WAFER PRODUCING METHOD
    • Publication number 20160228983
    • Publication date Aug 11, 2016
    • Disco Corporation
    • Kazuya Hirata
    • C30 - CRYSTAL GROWTH
  • Information Patent Application

    WAFER PRODUCING METHOD
    • Publication number 20160228984
    • Publication date Aug 11, 2016
    • Disco Corporation
    • Kazuya Hirata
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WAFER PRODUCING METHOD
    • Publication number 20160228985
    • Publication date Aug 11, 2016
    • Disco Corporation
    • Kazuya Hirata
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WAFER PRODUCING METHOD
    • Publication number 20160193691
    • Publication date Jul 7, 2016
    • Disco Corporation
    • Kazuya Hirata
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WAFER PRODUCING METHOD
    • Publication number 20160193690
    • Publication date Jul 7, 2016
    • Disco Corporation
    • Kazuya Hirata
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WAFER PRODUCING METHOD
    • Publication number 20160158892
    • Publication date Jun 9, 2016
    • Disco Corporation
    • Kazuya Hirata
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WAFER PRODUCING METHOD
    • Publication number 20160158881
    • Publication date Jun 9, 2016
    • Disco Corporation
    • Kazuya Hirata
    • C30 - CRYSTAL GROWTH
  • Information Patent Application

    WAFER PRODUCING METHOD
    • Publication number 20160158883
    • Publication date Jun 9, 2016
    • Disco Corporation
    • Kazuya Hirata
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WAFER PRODUCING METHOD
    • Publication number 20160158882
    • Publication date Jun 9, 2016
    • Disco Corporation
    • Kazuya Hirata
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SiC INGOT SLICING METHOD
    • Publication number 20160074960
    • Publication date Mar 17, 2016
    • Disco Corporation
    • Kazuya Hirata
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    LASER PROCESSING APPARATUS INCLUDING PLASMA DETECTING MEANS
    • Publication number 20130092669
    • Publication date Apr 18, 2013
    • Disco Corporation
    • Hiroshi MORIKAZU
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    METHOD OF PROCESSING OPTICAL DEVICE WAFER
    • Publication number 20130017640
    • Publication date Jan 17, 2013
    • Disco Corporation
    • Hiroshi Morikazu
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    LASER PROCESSING APPARATUS
    • Publication number 20120298636
    • Publication date Nov 29, 2012
    • Disco Corporation
    • Keiji Nomaru
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    LASER PROCESSING METHOD AND LASER PROCESSING APPARATUS
    • Publication number 20120292297
    • Publication date Nov 22, 2012
    • Disco Corporation
    • Hiroshi Morikazu
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    LASER PROCESSING METHOD FOR NONLINEAR CRYSTAL SUBSTRATE
    • Publication number 20120234809
    • Publication date Sep 20, 2012
    • Disco Corporation
    • Hiroshi Morikazu
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    OPTICAL DEVICE WAFER PROCESSING METHOD
    • Publication number 20120184084
    • Publication date Jul 19, 2012
    • Disco Corporation
    • Hiroshi Morikazu
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR