Yomiyuki Yama

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Hyogo, JP

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Patents Grantslast 30 patents

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Semiconductor device with tape automated bonding element
- Patent number 5,731,631
- Issue date Mar 24, 1998
- Mitsubishi Denki Kabushiki Kaisha
- Yomiyuki Yama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 5,701,033
- Issue date Dec 23, 1997
- Mitsubishi Denki Kabushiki Kaisha
- Tetsuya Ueda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating semiconductor device having sidewall spacers...
- Patent number 5,217,910
- Issue date Jun 8, 1993
- Mitsubishi Denki Kabushiki Kaisha
- Masahiro Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor device with high energy radiation absorbent...
- Patent number 5,150,180
- Issue date Sep 22, 1992
- Mitsubishi Denki Kabushiki Kaisha
- Yomiyuki Yama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and package
- Patent number 5,091,772
- Issue date Feb 25, 1992
- Mitsubishi Denki Kabushiki Kaisha
- Masanobu Kohara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device manufactured by using conductive ion implantat...
- Patent number 5,075,240
- Issue date Dec 24, 1991
- Mitsubishi Denki Kabushiki Kaisha
- Yomiyuki Yama
- H01 - BASIC ELECTRIC ELEMENTS