Yong CHEN

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Patents Grantslast 30 patents

Information Patent Grant
Multi-chip package
- Patent number 12,136,608
- Issue date Nov 5, 2024
- STMicroelectronics Pte Ltd
- Yong Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package
- Patent number 11,581,289
- Issue date Feb 14, 2023
- STMicroelectronics Pte Ltd
- Yong Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Server rack and data center including a hybrid-cooled server
- Patent number 11,497,145
- Issue date Nov 8, 2022
- National University of Singapore
- Poh Seng Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with electrical interconnection bridge
- Patent number 11,270,946
- Issue date Mar 8, 2022
- STMicroelectronics Pte Ltd
- Yong Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE WITH EXPOSED ELECTRICAL CONTACTS
- Publication number 20230230949
- Publication date Jul 20, 2023
- STMicroelectronics Pte Ltd
- Yong CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP PACKAGE
- Publication number 20230197688
- Publication date Jun 22, 2023
- STMicroelectronics Pte Ltd
- Yong CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SERVER, SERVER RACK AND DATA CENTRE
- Publication number 20210274683
- Publication date Sep 2, 2021
- National University of Singapore
- Poh Seng LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE WITH ELECTRICAL INTERCONNECTION BRIDGE
- Publication number 20210066198
- Publication date Mar 4, 2021
- STMicroelectronics Pte Ltd
- Yong CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP PACKAGE
- Publication number 20210035952
- Publication date Feb 4, 2021
- STMicroelectronics Pte Ltd
- Yong CHEN
- H01 - BASIC ELECTRIC ELEMENTS