Yong Chen

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Suzhou, JP

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Patents Grantslast 30 patents

Information Patent Grant
Pressure-bonded ball diameter detecting apparatus and pressure-bond...
- Patent number 8,149,276
- Issue date Apr 3, 2012
- Shinkawa Ltd.
- Kenji Sugawara
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for detecting press-bonded ball at bonding portion in bon...
- Patent number 7,929,152
- Issue date Apr 19, 2011
- Kabushiki Kaisha Shinkawa
- Kenji Sugawara
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Pressure-Bonded Ball Diameter Detecting Apparatus and Pressure-Bond...
- Publication number 20110128369
- Publication date Jun 2, 2011
- SHINKAWA LTD.
- Kenji SUGAWARA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Bonding apparatus and bonding method
- Publication number 20110114704
- Publication date May 19, 2011
- Shinkawa Ltd.
- Kenji Sugawara
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wire bonding method
- Publication number 20100072262
- Publication date Mar 25, 2010
- KABUSHIKI KAISHA SHINKAWA
- Kenji Sugawara
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Apparatus for detecting press-bonded ball at bonding portion in bon...
- Publication number 20080259352
- Publication date Oct 23, 2008
- KABUSHIKI KAISHA SHINKAWA
- Kenji Sugawara
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR