Yong Cheol Chu

Follow

Person

Jung-gu, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Metal core solder ball and heat dissipation structure for semicondu...
- Patent number 10,661,394
- Issue date May 26, 2020
- Duksan Hi-Metal Co., Ltd.
- Yong Cheol Chu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lead free solder alloy
- Patent number 8,221,560
- Issue date Jul 17, 2012
- Duksan Hi-Metal Co., Ltd.
- Kang Hee Kim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METAL CORE SOLDER BALL AND HEAT DISSIPATION STRUCTURE FOR SEMICONDU...
- Publication number 20140183733
- Publication date Jul 3, 2014
- DUKSAN HI-METAL CO., LTD.
- Yong Cheol CHU
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER INK AND ELECTRONIC DEVICE PACKAGE USING SAME
- Publication number 20120309866
- Publication date Dec 6, 2012
- DUK SAN TEKOPIA CO., LTD.
- Yong Un Jang
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
CONDUCTIVE ADHESIVE, METHOD FOR MANUFACTURING THE SAME, AND ELECTRO...
- Publication number 20120228560
- Publication date Sep 13, 2012
- Duk San Tekopia Co., Ltd.
- Yong Un Jang
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
SOLDER ADHESIVE AND A PRODUCTION METHOD FOR THE SAME, AND AN ELECTR...
- Publication number 20120067629
- Publication date Mar 22, 2012
- DUKSAN HI-METAL CO., LTD.
- Yong Un Jang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LEAD FREE SOLDER ALLOY AND MANUFACTURING METHOD THEREOF
- Publication number 20100272598
- Publication date Oct 28, 2010
- DUKSAN HI-METAL CO., LTD.
- Kang Hee Kim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR