Yong Chern Poh

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Johor, MY

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Patents Grantslast 30 patents

Information Patent Grant
Formation of conductive connection tracks in package mold body usin...
- Patent number 11,296,000
- Issue date Apr 5, 2022
- Infineon Technologies AG
- Cher Hau Danny Koh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Formation of conductive connection tracks in package mold body usin...
- Patent number 10,741,466
- Issue date Aug 11, 2020
- Infineon Technologies AG
- Cher Hau Danny Koh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded semiconductor package with C-wing and gull-wing leads
- Patent number 10,325,837
- Issue date Jun 18, 2019
- Infineon Technologies AG
- Cher Hau Danny Koh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacture of encapsulated package
- Patent number 7,674,657
- Issue date Mar 9, 2010
- Infineon Technologies AG
- Chai Wei Heng
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Formation of Conductive Connection Tracks in Package Mold Body Usin...
- Publication number 20200350222
- Publication date Nov 5, 2020
- Cher Hau Danny Koh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Formation of Conductive Connection Tracks in Package Mold Body Usin...
- Publication number 20190157173
- Publication date May 23, 2019
- INFINEON TECHNOLOGIES AG
- Cher Hau Danny Koh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Molded Semiconductor Package with C-Wing and Gull-Wing Leads
- Publication number 20190139869
- Publication date May 9, 2019
- INFINEON TECHNOLOGIES AG
- Cher Hau Danny Koh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Fabrication Method
- Publication number 20130154123
- Publication date Jun 20, 2013
- INFINEON TECHNOLOGIES AG
- Yong Chern Poh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, LEADFRAME AND METHOD OF ENCAPSULATING
- Publication number 20100193920
- Publication date Aug 5, 2010
- INFINEON TECHNOLOGIES AG
- Yong Chern Poh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Manufacture of Encapsulated Package
- Publication number 20080157433
- Publication date Jul 3, 2008
- Chai Wei Heng
- H01 - BASIC ELECTRIC ELEMENTS