Yong Guan

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Shanghai, CN

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Patents Applicationslast 30 patents

Information Patent Application
Chip Package on Package Structure, Packaging Method Thereof, and El...
- Publication number 20220262751
- Publication date Aug 18, 2022
- Huawei Technologies Co., Ltd
- Tonglong Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip Package Structure and Chip Packaging Method
- Publication number 20220077123
- Publication date Mar 10, 2022
- Huawei Technologies Co., Ltd
- Tonglong Zhang
- H01 - BASIC ELECTRIC ELEMENTS