Yong Jin SEOL

Person

Gyunggi-do, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Fan-out semiconductor package module
- Patent number 10,340,245
- Issue date Jul 2, 2019
- Samsung Electro-Mechanics Co., Ltd.
- Yong Jin Seol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out semiconductor package
- Patent number 10,229,865
- Issue date Mar 12, 2019
- Samsung Electro-Mechanics Co., Ltd.
- Yong Jin Seol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out semiconductor package module
- Patent number 10,192,844
- Issue date Jan 29, 2019
- Samsung Electro-Mechanics Co., Ltd.
- Yong Jin Seol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out semiconductor package and method of manufacturing same
- Patent number 9,899,331
- Issue date Feb 20, 2018
- Samsung Electro-Mechanics Co., Ltd.
- Yong Koon Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FAN-OUT SEMICONDUCTOR PACKAGE
- Publication number 20190198429
- Publication date Jun 27, 2019
- Samsung Electro-Mechanics Co., Ltd.
- Myung Sam KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT SEMICONDUCTOR PACKAGE
- Publication number 20190164926
- Publication date May 30, 2019
- Samsung Electro-Mechanics Co., Ltd.
- Yong Jin Seol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT SEMICONDUCTOR PACKAGE MODULE
- Publication number 20180158791
- Publication date Jun 7, 2018
- Samsung Electro-Mechanics Co., Ltd.
- Yong Jin SEOL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT SEMICONDUCTOR PACKAGE MODULE
- Publication number 20180061801
- Publication date Mar 1, 2018
- Samsung Electro-Mechanics Co., Ltd.
- Yong Jin SEOL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT SEMICONDUCTOR PACKAGE
- Publication number 20170373029
- Publication date Dec 28, 2017
- Samsung Electro-Mechanics Co., Ltd.
- Yong Jin SEOL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT SEMICONDUCTOR PACKAGE MODULE
- Publication number 20170373035
- Publication date Dec 28, 2017
- Samsung Electro-Mechanics Co., Ltd.
- Yong Jin SEOL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SAME
- Publication number 20170287839
- Publication date Oct 5, 2017
- Samsung Electro-Mechanics Co., Ltd.
- Yong Koon LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SAME
- Publication number 20170287825
- Publication date Oct 5, 2017
- Samsung Electro-Mechanics Co., Ltd.
- Yong Koon LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CABLE, AND INPUT APPARATUS INCLUDING THE SAME, AND COMPUTER APPARATUS
- Publication number 20140062811
- Publication date Mar 6, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Yong Jin SEOL
- H01 - BASIC ELECTRIC ELEMENTS

Yong Jin SEOL

Person

Patents Grantslast 30 patents

Fan-out semiconductor package module

Fan-out semiconductor package

Fan-out semiconductor package module

Fan-out semiconductor package and method of manufacturing same

Patents Applicationslast 30 patents

FAN-OUT SEMICONDUCTOR PACKAGE

FAN-OUT SEMICONDUCTOR PACKAGE

FAN-OUT SEMICONDUCTOR PACKAGE MODULE

FAN-OUT SEMICONDUCTOR PACKAGE MODULE

FAN-OUT SEMICONDUCTOR PACKAGE

FAN-OUT SEMICONDUCTOR PACKAGE MODULE

FAN-OUT SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SAME

FAN-OUT SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SAME

CABLE, AND INPUT APPARATUS INCLUDING THE SAME, AND COMPUTER APPARATUS