Yong Kang

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Wuhan, CN

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Patents Grantslast 30 patents

Information Patent Grant
Manifold microchannel heat sink based on directional optimization o...
- Patent number 12,178,022
- Issue date Dec 24, 2024
- Huazhong University of Science & Technology
- Zhiqiang Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Evaluation module and evaluation method for evaluating multichip mo...
- Patent number 12,111,348
- Issue date Oct 8, 2024
- Robert Bosch GmbH
- Lin Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for predicting junction temperature of power semi...
- Patent number 11,976,984
- Issue date May 7, 2024
- Huazhong University of Science & Technology
- Zhiqiang Wang
- G01 - MEASURING TESTING
Information Patent Grant
Three-dimensional packaging structure and packaging method of power...
- Patent number 10,943,845
- Issue date Mar 9, 2021
- Huazhong University of Science & Technology
- Cai Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional packaging structure and packaging method of power...
- Patent number 10,354,937
- Issue date Jul 16, 2019
- Huazhong University of Science & Technology
- Cai Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
MANIFOLD MICROCHANNEL HEAT SINK BASED ON DIRECTIONAL OPTIMIZATION O...
- Publication number 20240284644
- Publication date Aug 22, 2024
- HUAZHONG UNIVERSITY OF SCIENCE & TECHNOLOGY
- Zhiqiang WANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Evaluation Module and Evaluation Method for Evaluating Multichip Mo...
- Publication number 20220099731
- Publication date Mar 31, 2022
- ROBERT BOSCH GmbH
- Lin Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL PACKAGING STRUCTURE AND PACKAGING METHOD OF POWER...
- Publication number 20190287876
- Publication date Sep 19, 2019
- HUAZHONG UNIVERSITY OF SCIENCE & TECHNOLOGY
- Cai CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL PACKAGING STRUCTURE AND PACKAGING METHOD OF POWER...
- Publication number 20190067151
- Publication date Feb 28, 2019
- HUAZHONG UNIVERSITY OF SCIENCE & TECHNOLOGY
- Cai CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
System and method for reactive power compensation and flicker manag...
- Publication number 20100109616
- Publication date May 6, 2010
- Huaqiang Li
- G05 - CONTROLLING REGULATING