Yong Kee Yeo

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Singapore, SG

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Patents Grantslast 30 patents

Information Patent Grant
Enhanced chip scale package for wire bond dies
- Patent number 6,710,438
- Issue date Mar 23, 2004
- Institute of Microelectronics
- Yong Kee Yeo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical device carrier
- Patent number 6,617,667
- Issue date Sep 9, 2003
- Mitsubishi Denki Kabushiki Kaisha
- Mui Seng Yeo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhanced chip scale package for flip chips
- Patent number 6,608,379
- Issue date Aug 19, 2003
- Institute of Microelectronics, et al.
- Yong Kee Yeo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High frequency board-to-board connector
- Patent number 6,599,138
- Issue date Jul 29, 2003
- Institute of Microelectronics
- Yong Kee Yeo
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Enhanced chip scale package for wire bond dies
- Publication number 20030155641
- Publication date Aug 21, 2003
- Yong Kee Yeo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENHANCED CHIP SCALE PACKAGE FOR FLIP CHIPS
- Publication number 20030132529
- Publication date Jul 17, 2003
- Yong Kee Yeo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Optical device carrier
- Publication number 20030052380
- Publication date Mar 20, 2003
- Mui Seng Yeo
- H01 - BASIC ELECTRIC ELEMENTS