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Singapore, SG
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last 30 patents
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Patent Grant
Entire encapsulation of Cu interconnects using self-aligned CuSiN film
Patent number
7,524,755
Issue date
Apr 28, 2009
Chartered Semiconductor Manufacturing, Ltd.
Johnny Widodo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for fabricating an air gap metallization scheme that reduces...
Patent number
6,380,106
Issue date
Apr 30, 2002
Chartered Semiconductor Manufacturing Inc.
Seng Keong Victor Lim
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
Implantation for shallow trench isolation (STI) formation and for s...
Publication number
20090315115
Publication date
Dec 24, 2009
CHARTERED SEMICONDUCTOR MANUFACTURING, LTD.
Beichao Zhang
H01 - BASIC ELECTRIC ELEMENTS