Yong-Kyun Sun

Person

Cheonan-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Equipment and method for cutting package
- Patent number 8,132,305
- Issue date Mar 13, 2012
- Samsung Electronics Co., Ltd.
- Tai-Kew Choi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Die attaching apparatus
- Patent number 7,650,687
- Issue date Jan 26, 2010
- Samsung Electronics Co., Ltd.
- Jung-Hwan Woo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System for testing memory modules using a rotating-type module moun...
- Patent number 7,602,171
- Issue date Oct 13, 2009
- Samsung Electronics Co., Ltd.
- Sun Choi
- G11 - INFORMATION STORAGE
Information Patent Grant
Wafer sawing apparatus having washing solution spray and suction de...
- Patent number 6,105,567
- Issue date Aug 22, 2000
- Samsung Electronics Co., Ltd.
- Yong Kyun Sun
- B28 - WORKING CEMENT, CLAY, OR STONE

Patents Applicationslast 30 patents

Information Patent Application
DIPPING DETECTING DEVICE FOR FABRICATING A SEMICONDUCTOR DEVICE
- Publication number 20080090311
- Publication date Apr 17, 2008
- Samsung Electronics Co., Ltd.
- Dong-joo ROH
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
EQUIPMENT AND METHOD FOR CUTTING PACKAGE
- Publication number 20080056832
- Publication date Mar 6, 2008
- Samsung Electronics Co., Ltd.
- Tai-Kew CHOI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Apparatus for testing a semiconductor module
- Publication number 20070138466
- Publication date Jun 21, 2007
- SAMSUNG ELECTRONICS CO., LTD.
- Dong-Soo Lee
- G01 - MEASURING TESTING
Information Patent Application
System for testing memory modules using a rotating-type module moun...
- Publication number 20070079187
- Publication date Apr 5, 2007
- Sun Choi
- G01 - MEASURING TESTING
Information Patent Application
Multi-chip die bonder and method
- Publication number 20060266792
- Publication date Nov 30, 2006
- Youn-Sung Ko
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Sawing and sorting system
- Publication number 20060056955
- Publication date Mar 16, 2006
- Yong-Kuk Kim
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
Die attaching apparatus, and system and method for cleaning the same
- Publication number 20060048381
- Publication date Mar 9, 2006
- Jung-Hwan Woo
- H01 - BASIC ELECTRIC ELEMENTS

Yong-Kyun Sun

Person

Patents Grantslast 30 patents

Equipment and method for cutting package

Die attaching apparatus

System for testing memory modules using a rotating-type module moun...

Wafer sawing apparatus having washing solution spray and suction de...

Patents Applicationslast 30 patents

DIPPING DETECTING DEVICE FOR FABRICATING A SEMICONDUCTOR DEVICE

EQUIPMENT AND METHOD FOR CUTTING PACKAGE

Apparatus for testing a semiconductor module

System for testing memory modules using a rotating-type module moun...

Multi-chip die bonder and method

Sawing and sorting system

Die attaching apparatus, and system and method for cleaning the same