Yong Lin

Person

Plano, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Printed adhesion deposition to mitigate integrated circuit package...
- Patent number 10,727,085
- Issue date Jul 28, 2020
- Texas Instruments Incorporated
- Yong Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor device having nanoparticle adhesion layer pa...
- Patent number 10,636,679
- Issue date Apr 28, 2020
- Texas Instruments Incorporated
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor device having nanoparticle adhesion layer pa...
- Patent number 10,354,890
- Issue date Jul 16, 2019
- Texas Instruments Incorporated
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed adhesion deposition to mitigate integrated circuit delamina...
- Patent number 10,347,508
- Issue date Jul 9, 2019
- Texas Instruments Incorporated
- Yong Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame surface modifications for high voltage isolation
- Patent number 10,147,672
- Issue date Dec 4, 2018
- Texas Instruments Incorporated
- Yong Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor device having nanoparticle adhesion layer pa...
- Patent number 9,865,527
- Issue date Jan 9, 2018
- Texas Instruments Incorporated
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged device with additive substrate surface modification
- Patent number 9,780,017
- Issue date Oct 3, 2017
- Texas Instruments Incorporated
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged IC with solderable sidewalls
- Patent number 9,780,060
- Issue date Oct 3, 2017
- Texas Instruments Incorporated
- Yong Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged device with additive substrate surface modification
- Patent number 9,524,926
- Issue date Dec 20, 2016
- Texas Instruments Incorporated
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for stopping resin bleed and mold flash on int...
- Patent number 9,054,092
- Issue date Jun 9, 2015
- Texas Instruments Incorporated
- Bernardo Gallegos
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Packaged Semiconductor Device Having Nanoparticle Adhesion Layer Pa...
- Publication number 20190371624
- Publication date Dec 5, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaged Semiconductor Device Having Nanoparticle Adhesion Layer Pa...
- Publication number 20180182693
- Publication date Jun 28, 2018
- TEXASINSTRUMENTSlNCORPORATED
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bi-Layer Nanoparticle Adhesion Film
- Publication number 20180166369
- Publication date Jun 14, 2018
- TEXAS INSTRUMENTS INCORPORATED
- Benjamin Stassen Cook
- B32 - LAYERED PRODUCTS
Information Patent Application
Packaged IC With Solderable Sidewalls
- Publication number 20170365575
- Publication date Dec 21, 2017
- TEXAS INSTRUMENTS INCORPORATED
- Yong Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Lead Frame Surface Modifications for High Voltage Isolation
- Publication number 20170309553
- Publication date Oct 26, 2017
- TEXAS INSTRUMENTS INCORPORATED
- Yong Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED ADHESION DEPOSITION TO MITIGATE INTEGRATED CIRCUIT DELAMINA...
- Publication number 20170271174
- Publication date Sep 21, 2017
- TEXAS INSTRUMENTS INCORPORATED
- YONG LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED ADHESION DEPOSITION TO MITIGATE INTEGRATED CIRCUIT DELAMINA...
- Publication number 20170194170
- Publication date Jul 6, 2017
- TEXAS INSTRUMENTS INCORPORATED
- YONG LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaged IC with Solderable Sidewalls
- Publication number 20170162530
- Publication date Jun 8, 2017
- TEXAS INSTRUMENTS INCORPORATED
- Yong Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaged Device with Additive Substrate Surface Modification
- Publication number 20170053854
- Publication date Feb 23, 2017
- TEXAS INSTRUMENTS INCORPORATED
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED DEVICE WITH ADDITIVE SUBSTRATE SURFACE MODIFICATION
- Publication number 20160093558
- Publication date Mar 31, 2016
- TEXAS INSTRUMENTS INCORPORATED
- BENJAMIN STASSEN COOK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AN APPARATUS FOR STOPPING RESIN BLEED AND MOLD FLASH ON INTE...
- Publication number 20150115421
- Publication date Apr 30, 2015
- TEXAS INSTRUMENTS INCORPORATED
- Bernardo Gallegos
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Printed adhesion deposition to mitigate integrated circuit package...

Packaged semiconductor device having nanoparticle adhesion layer pa...

Packaged semiconductor device having nanoparticle adhesion layer pa...

Printed adhesion deposition to mitigate integrated circuit delamina...

Lead frame surface modifications for high voltage isolation

Packaged semiconductor device having nanoparticle adhesion layer pa...

Packaged device with additive substrate surface modification

Packaged IC with solderable sidewalls

Packaged device with additive substrate surface modification

Method and apparatus for stopping resin bleed and mold flash on int...

Patents Applicationslast 30 patents

Packaged Semiconductor Device Having Nanoparticle Adhesion Layer Pa...

Packaged Semiconductor Device Having Nanoparticle Adhesion Layer Pa...

Bi-Layer Nanoparticle Adhesion Film

Packaged IC With Solderable Sidewalls

Lead Frame Surface Modifications for High Voltage Isolation

PRINTED ADHESION DEPOSITION TO MITIGATE INTEGRATED CIRCUIT DELAMINA...

PRINTED ADHESION DEPOSITION TO MITIGATE INTEGRATED CIRCUIT DELAMINA...

Packaged IC with Solderable Sidewalls

Packaged Device with Additive Substrate Surface Modification

PACKAGED DEVICE WITH ADDITIVE SUBSTRATE SURFACE MODIFICATION

METHOD AN APPARATUS FOR STOPPING RESIN BLEED AND MOLD FLASH ON INTE...