Yong LIU

Person

Cumberland Foreside, ME, US

People

Patents Grantslast 30 patents

Information Patent Grant
Thermal performance improvement and stress reduction in semiconduct...
- Patent number 12,191,264
- Issue date Jan 7, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Yong Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual-side cooling semiconductor packages and related methods
- Patent number 12,154,844
- Issue date Nov 26, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Yong Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and related methods
- Patent number 12,062,549
- Issue date Aug 13, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Yong Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module
- Patent number 11,894,292
- Issue date Feb 6, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Qing Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method related to a power module using a hybrid spacer
- Patent number 11,842,942
- Issue date Dec 12, 2023
- Semiconductor Components Industries, LLC
- Liangbiao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe spacer for double-sided power module
- Patent number 11,830,784
- Issue date Nov 28, 2023
- Semiconductor Components Industries, LLC
- Tzu-Hsuan Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module with substrate recess for conductive-bonding component
- Patent number 11,776,871
- Issue date Oct 3, 2023
- Semiconductor Components Industries, LLC
- Leo Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual-side cooling semiconductor packages and related methods
- Patent number 11,646,249
- Issue date May 9, 2023
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Yong Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assembly processes for semiconductor device assemblies including sp...
- Patent number 11,594,510
- Issue date Feb 28, 2023
- Semiconductor Components Industries, LLC
- Yong Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Spacer with pattern layout for dual side cooling power module
- Patent number 11,562,938
- Issue date Jan 24, 2023
- Semiconductor Components Industries, LLC
- Yong Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reducing stress cracks in substrates
- Patent number 11,521,928
- Issue date Dec 6, 2022
- Semiconductor Components Industries, LLC
- Yong Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module
- Patent number 11,315,859
- Issue date Apr 26, 2022
- Semiconductor Components Industries, LLC
- Qing Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method related to a power module using a hybrid spacer
- Patent number 11,282,764
- Issue date Mar 22, 2022
- Semiconductor Components Industries, LLC
- Liangbiao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe spacer for double-sided power module
- Patent number 11,121,055
- Issue date Sep 14, 2021
- Semiconductor Components Industries, LLC
- Tzu-Hsuan Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and related methods
- Patent number 11,075,090
- Issue date Jul 27, 2021
- Semiconductor Components Industries, LLC
- Yong Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assemblies including spacer with embedded semi...
- Patent number 10,991,670
- Issue date Apr 27, 2021
- Semiconductor Components Industries, LLC
- Yong Liu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FLIP CHIP AND PRE-MOLDED CLIP POWER MODULES
- Publication number 20250006603
- Publication date Jan 2, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Yong LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH MOLDING CAVITY
- Publication number 20240371659
- Publication date Nov 7, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Yong LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND RELATED METHODS
- Publication number 20240355638
- Publication date Oct 24, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Yong LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROTECTION DAM FOR A POWER MODULE WITH SPACERS
- Publication number 20240282668
- Publication date Aug 22, 2024
- Semiconductor Components Industries, LLC
- Yong LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD RELATED TO A POWER MODULE USING A HYBRID SPACER
- Publication number 20240136247
- Publication date Apr 25, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Liangbiao CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME SPACER FOR DOUBLE-SIDED POWER MODULE
- Publication number 20240096734
- Publication date Mar 21, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Tzu-Hsuan CHENG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DUAL SIDE COOLED POWER MODULE WITH THREE-DIMENSIONAL DIRECT BONDED...
- Publication number 20240030122
- Publication date Jan 25, 2024
- Semiconductor Components Industries, LLC
- Yong LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULE WITH SUBSTRATE RECESS FOR CONDUCTIVE-BONDING COMPONENT
- Publication number 20240030093
- Publication date Jan 25, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Leo GU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL PERFORMANCE IMPROVEMENT AND STRESS REDUCTION IN SEMICONDUCT...
- Publication number 20230326876
- Publication date Oct 12, 2023
- Semiconductor Components Industries, LLC
- Yong LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL-SIDE COOLING SEMICONDUCTOR PACKAGES AND RELATED METHODS
- Publication number 20230238307
- Publication date Jul 27, 2023
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Yong LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPACER WITH PATTERN LAYOUT FOR DUAL SIDE COOLING POWER MODULE
- Publication number 20220208635
- Publication date Jun 30, 2022
- Semiconductor Components Industries, LLC
- Yong LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL-SIDE COOLING SEMICONDUCTOR PACKAGES AND RELATED METHODS
- Publication number 20220208653
- Publication date Jun 30, 2022
- Semiconductor Components Industries, LLC
- Yong LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD RELATED TO A POWER MODULE USING A HYBRID SPACER
- Publication number 20220208637
- Publication date Jun 30, 2022
- Semiconductor Components Industries, LLC
- Liangbiao CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE
- Publication number 20220208666
- Publication date Jun 30, 2022
- Semiconductor Components Industries, LLC
- Qing YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULE WITH SUBSTRATE RECESS FOR CONDUCTIVE-BONDING COMPONENT
- Publication number 20220189848
- Publication date Jun 16, 2022
- Semiconductor Components Industries, LLC
- Leo GU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCING STRESS CRACKS IN SUBSTRATES
- Publication number 20220173049
- Publication date Jun 2, 2022
- Semiconductor Components Industries, LLC
- Yong LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE
- Publication number 20220130740
- Publication date Apr 28, 2022
- Semiconductor Components Industries, LLC
- Qing YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME SPACER FOR DOUBLE-SIDED POWER MODULE
- Publication number 20210398874
- Publication date Dec 23, 2021
- Semiconductor Components Industries, LLC
- Tzu-Hsuan CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND RELATED METHODS
- Publication number 20210320013
- Publication date Oct 14, 2021
- Semiconductor Components Industries, LLC
- Yong LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD RELATED TO A POWER MODULE USING A HYBRID SPACER
- Publication number 20210249329
- Publication date Aug 12, 2021
- Semiconductor Components Industries, LLC
- Liangbiao CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ASSEMBLY PROCESSES FOR SEMICONDUCTOR DEVICE ASSEMBLIES INCLUDING SP...
- Publication number 20210225797
- Publication date Jul 22, 2021
- Semiconductor Components Industries, LLC
- Yong LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME SPACER FOR DOUBLE-SIDED POWER MODULE
- Publication number 20210217679
- Publication date Jul 15, 2021
- Semiconductor Components Industries, LLC
- Tzu-Hsuan CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND RELATED METHODS
- Publication number 20210134606
- Publication date May 6, 2021
- Semiconductor Components Industries, LLC
- Yong LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLIES INCLUDING SPACER WITH EMBEDDED SEMI...
- Publication number 20200105706
- Publication date Apr 2, 2020
- Semiconductor Components Industries, LLC
- Yong LIU
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Thermal performance improvement and stress reduction in semiconduct...

Dual-side cooling semiconductor packages and related methods

Semiconductor packages and related methods

Power module

Structure and method related to a power module using a hybrid spacer

Leadframe spacer for double-sided power module

Module with substrate recess for conductive-bonding component

Dual-side cooling semiconductor packages and related methods

Assembly processes for semiconductor device assemblies including sp...

Spacer with pattern layout for dual side cooling power module

Reducing stress cracks in substrates

Power module

Structure and method related to a power module using a hybrid spacer

Leadframe spacer for double-sided power module

Semiconductor packages and related methods

Semiconductor device assemblies including spacer with embedded semi...

Patents Applicationslast 30 patents

FLIP CHIP AND PRE-MOLDED CLIP POWER MODULES

PACKAGE WITH MOLDING CAVITY

SEMICONDUCTOR PACKAGES AND RELATED METHODS

PROTECTION DAM FOR A POWER MODULE WITH SPACERS

STRUCTURE AND METHOD RELATED TO A POWER MODULE USING A HYBRID SPACER

LEADFRAME SPACER FOR DOUBLE-SIDED POWER MODULE

DUAL SIDE COOLED POWER MODULE WITH THREE-DIMENSIONAL DIRECT BONDED...

MODULE WITH SUBSTRATE RECESS FOR CONDUCTIVE-BONDING COMPONENT

THERMAL PERFORMANCE IMPROVEMENT AND STRESS REDUCTION IN SEMICONDUCT...

DUAL-SIDE COOLING SEMICONDUCTOR PACKAGES AND RELATED METHODS

SPACER WITH PATTERN LAYOUT FOR DUAL SIDE COOLING POWER MODULE

DUAL-SIDE COOLING SEMICONDUCTOR PACKAGES AND RELATED METHODS

STRUCTURE AND METHOD RELATED TO A POWER MODULE USING A HYBRID SPACER

POWER MODULE

MODULE WITH SUBSTRATE RECESS FOR CONDUCTIVE-BONDING COMPONENT

REDUCING STRESS CRACKS IN SUBSTRATES

POWER MODULE

LEADFRAME SPACER FOR DOUBLE-SIDED POWER MODULE

SEMICONDUCTOR PACKAGES AND RELATED METHODS

STRUCTURE AND METHOD RELATED TO A POWER MODULE USING A HYBRID SPACER

ASSEMBLY PROCESSES FOR SEMICONDUCTOR DEVICE ASSEMBLIES INCLUDING SP...

LEADFRAME SPACER FOR DOUBLE-SIDED POWER MODULE

SEMICONDUCTOR PACKAGES AND RELATED METHODS

SEMICONDUCTOR DEVICE ASSEMBLIES INCLUDING SPACER WITH EMBEDDED SEMI...