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Daejeon, KR
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Patents Grants
last 30 patents
Information
Patent Grant
Method for transferring and bonding of devices
Patent number
11,677,060
Issue date
Jun 13, 2023
ELECTRONICS AND TELEOCMMUNICATIONS RESEARCH INSTITUTE
Jiho Joo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wire for electric bonding
Patent number
11,618,109
Issue date
Apr 4, 2023
Electronics and Telecommunications Research Institute
Gwang-Mun Choi
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method for manufacturing semiconductor package
Patent number
11,488,841
Issue date
Nov 1, 2022
Electronics and Telecommunications Research Institute
Yong Sung Eom
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Laser bonding method
Patent number
11,107,790
Issue date
Aug 31, 2021
Electronics and Telecommunications Research Institute
Kwang-Seong Choi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Exhaust gas purification apparatus and exhaust gas purification met...
Patent number
11,053,824
Issue date
Jul 6, 2021
KOREA ELECTRIC POWER CORPORATION
Yong Seok Eom
B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information
Patent Grant
System for evaluating performance of carbon dioxide separation memb...
Patent number
10,821,405
Issue date
Nov 3, 2020
KOREA ELASTIC POWER CORPORATION
Jung Bin Lee
G01 - MEASURING TESTING
Information
Patent Grant
Method of fabricating a semiconductor package
Patent number
10,636,761
Issue date
Apr 28, 2020
Electronics and Telecommunications Reearch Institute
Kwang-Seong Choi
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Pattern-forming method for forming a conductive circuit pattern
Patent number
9,980,393
Issue date
May 22, 2018
Electronics and Telecommunications Research Institute
Yong Sung Eom
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Method of fabricating a semiconductor package
Patent number
9,853,010
Issue date
Dec 26, 2017
ELECTGRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
Kwang-Seong Choi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bonding structure of electronic equipment
Patent number
9,538,666
Issue date
Jan 3, 2017
Electronics and Telecommunications Research Institute
Kwang-Seong Choi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Transmitting and receiving package
Patent number
9,490,198
Issue date
Nov 8, 2016
Electronics and Telecommunications Research Institute
Yong Sung Eom
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Composition and methods of forming solder bump and flip chip using...
Patent number
9,462,736
Issue date
Oct 4, 2016
Electronics and Telecommunications Research Institute
Yong Sung Eom
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Composition and methods of forming solder bump and flip chip using...
Patent number
9,155,236
Issue date
Oct 6, 2015
Electronics and Telecommunications Research Institute
Yong Sung Eom
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method of fabricating a solder-on-pad structure and flip-chip bondi...
Patent number
9,034,750
Issue date
May 19, 2015
Electronics and Telecommunications Research Institute
Kwang-Seong Choi
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Methods of forming bump and semiconductor device with the same
Patent number
9,006,037
Issue date
Apr 14, 2015
Electronics and Telecommunications Research Institute
Kwang-Seong Choi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Composition and methods of forming solder bump and flip chip using...
Patent number
8,802,760
Issue date
Aug 12, 2014
Electronics and Telecommunications Research Institute
Yong Sung Eom
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method of forming solder on pad on fine pitch PCB and method of fli...
Patent number
8,794,502
Issue date
Aug 5, 2014
Electronics and Telecommunications Research Institute
Yong Sung Eom
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Sensing device having multi beam antenna array
Patent number
8,547,278
Issue date
Oct 1, 2013
Electronics and Telecommunications Research Institute
Dong Suk Jun
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Vacuum wafer level packaging method for micro electro mechanical sy...
Patent number
8,524,571
Issue date
Sep 3, 2013
Electronics and Telecommunications Research Institute
Jong Tae Moon
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Composition and methods of forming solder bump and flip chip using...
Patent number
8,420,722
Issue date
Apr 16, 2013
Electronics and Telecommunications Research Institute
Yong Sung Eom
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method and structure for bonding flip chip
Patent number
8,211,745
Issue date
Jul 3, 2012
Electronics and Telecommunications Research Institute
Yong Sung Eom
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic device including LTCC inductor
Patent number
8,044,757
Issue date
Oct 25, 2011
Electronics and Telecommunications Research Institute
Hyun-Cheol Bae
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for fabricating a semiconductor package
Patent number
8,030,200
Issue date
Oct 4, 2011
Electronics and Telecommunications Research Institute
Yong Sung Eom
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wafer level package and method of fabricating the same
Patent number
7,985,697
Issue date
Jul 26, 2011
Electronics and Telecommunications Research Institute
Jong Tae Moon
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Transceiver module and optical bench for passive alignment
Patent number
7,520,682
Issue date
Apr 21, 2009
Electronics and Telecommunications Research Institute
Yong-Sung Eom
G02 - OPTICS
Information
Patent Grant
Surface emitting laser device including optical sensor and optical...
Patent number
7,244,923
Issue date
Jul 17, 2007
Electronics and Telecommunications Research Institute
Hyun Woo Song
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wavelength stabilization module having light-receiving element arra...
Patent number
7,012,939
Issue date
Mar 14, 2006
Electronics and Telecommunications Research Institute
Kwang Seong Choi
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information
Patent Grant
Method for optical module packaging of flip chip bonding
Patent number
6,825,065
Issue date
Nov 30, 2004
Electronics and Telecommunications Research Institute
Jong-tae Moon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Optical module package of flip chip bonding
Patent number
6,707,161
Issue date
Mar 16, 2004
Electronics and Telecommunications Research Institute
Jong-tae Moon
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
BONDING APPARATUS
Publication number
20240021570
Publication date
Jan 18, 2024
ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
Jiho JOO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SILYL ETHER ISOHEXIDE-BASED ORGANIC-INORGANIC COMPOUND, METHOD FOR...
Publication number
20230391956
Publication date
Dec 7, 2023
ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
GWANG-MUN CHOI
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information
Patent Application
MICROWAVE HEATING DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR...
Publication number
20230326810
Publication date
Oct 12, 2023
ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
GWANG-MUN CHOI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC DEVICE AND ITS REPAIR METHOD
Publication number
20230027892
Publication date
Jan 26, 2023
ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
KWANG-SEONG CHOI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LASER CONTROL STRUCTURE AND LASER BONDING METHOD USING THE SAME
Publication number
20220402070
Publication date
Dec 22, 2022
ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
Ki Seok JANG
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
METHOD OF MANUFACTURING ELECTRIC DEVICE
Publication number
20220384674
Publication date
Dec 1, 2022
ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
Jiho JOO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF FABRICATING SEMICONDUCTOR PACKAGE
Publication number
20220102603
Publication date
Mar 31, 2022
ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
Kwang-Seong CHOI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
COMPOSITION FOR CONDUCTIVE ADHESIVE, SEMICONDUCTOR PACKAGE COMPRISI...
Publication number
20220077099
Publication date
Mar 10, 2022
ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
Gwang-Mun CHOI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WIRE FOR ELECTRIC BONDING
Publication number
20210402525
Publication date
Dec 30, 2021
ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
GWANG-MUN CHOI
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
LASER BONDING METHOD AND A SEMICONDUCTOR PACKAGE INCLUDING A BONDIN...
Publication number
20210358885
Publication date
Nov 18, 2021
ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
Kwang-Seong CHOI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR TRANSFERRING AND BONDING OF DEVICES
Publication number
20210320236
Publication date
Oct 14, 2021
ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
Jiho JOO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
TRANSFER AND BONDING METHOD USING LASER
Publication number
20210252620
Publication date
Aug 19, 2021
ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
KWANG-SEONG CHOI
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
EXHAUST GAS PURIFICATION APPARATUS AND EXHAUST GAS PURIFICATION MET...
Publication number
20200355103
Publication date
Nov 12, 2020
Korea Electric Power Corporation
Yong Seok Eom
F01 - MACHINES OR ENGINES IN GENERAL ENGINE PLANTS IN GENERAL STEAM ENGINES
Information
Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE
Publication number
20200266078
Publication date
Aug 20, 2020
ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
Yong Sung EOM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SYSTEM FOR EVALUATING PERFORMANCE OF CARBON DIOXIDE SEPARATION MEMB...
Publication number
20200179879
Publication date
Jun 11, 2020
KOREA ELECTRIC POWER CORPORATION
Jung Bin LEE
G01 - MEASURING TESTING
Information
Patent Application
LASER BONDING METHOD
Publication number
20200075535
Publication date
Mar 5, 2020
ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
Kwang-Seong CHOI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FILLING COMPOSITION FOR SEMICONDUCTOR PACKAGE
Publication number
20190287870
Publication date
Sep 19, 2019
ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
KeonSoo JANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ADHESIVE FILM FOR ELECTRIC DEVICE AND METHOD OF FABRICATING SEMICON...
Publication number
20190211231
Publication date
Jul 11, 2019
ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
KeonSoo JANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF FABRICATING A SEMICONDUCTOR PACKAGE
Publication number
20190067235
Publication date
Feb 28, 2019
ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
Kwang-Seong CHOI
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
METHOD OF FABRICATING A SEMICONDUCTOR PACKAGE
Publication number
20170141071
Publication date
May 18, 2017
ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
Kwang-Seong CHOI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
Publication number
20160358892
Publication date
Dec 8, 2016
ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
Haksun LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
TRANSCEIVER MODULE AND COMMUNICATION APPARATUS INCLUDING THE SAME
Publication number
20160094258
Publication date
Mar 31, 2016
ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
Hyun-cheol BAE
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information
Patent Application
STACK MODULE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
Publication number
20150364445
Publication date
Dec 17, 2015
ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
Kwang Seong CHOI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PATTERN-FORMING COMPOSITION AND PATTERN-FORMING METHOD USING THE SAME
Publication number
20150237739
Publication date
Aug 20, 2015
ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
Yong Sung EOM
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
Publication number
20150228617
Publication date
Aug 13, 2015
ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
Haksun LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BONDING STRUCTURE OF ELECTRONIC EQUIPMENT
Publication number
20150043175
Publication date
Feb 12, 2015
ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
KWANG-SEONG CHOI
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
METHOD OF FABRICATING A SOLDER PARTICLE
Publication number
20140367375
Publication date
Dec 18, 2014
ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
Hyun-cheol BAE
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
COMPOSITION AND METHODS OF FORMING SOLDER BUMP AND FLIP CHIP USING...
Publication number
20140317915
Publication date
Oct 30, 2014
ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
Yong Sung EOM
B82 - NANO-TECHNOLOGY
Information
Patent Application
COMPOSITION AND METHODS OF FORMING SOLDER BUMP AND FLIP CHIP USING...
Publication number
20140317918
Publication date
Oct 30, 2014
ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
Yong Sung EOM
B82 - NANO-TECHNOLOGY
Information
Patent Application
CONDUCTIVE COMPOSITION, SILICON SOLAR CELL INCLUDING THE SAME, AND...
Publication number
20140318615
Publication date
Oct 30, 2014
ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
Soo Young OH
H01 - BASIC ELECTRIC ELEMENTS