Yong Teck Yang

Person

Singapore, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Leadframe area array packaging technology
- Patent number 9,472,532
- Issue date Oct 18, 2016
- UTAC HEADQUARTERS PTE. LTD.
- Antonio Bambalan Dimaano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of packaging semiconductor devices
- Patent number 9,165,878
- Issue date Oct 20, 2015
- United Test & Assembly Center Ltd.
- Yong Bo Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe area array packaging technology
- Patent number 9,023,690
- Issue date May 5, 2015
- United Test and Assembly Center
- Antonio Bambalan Dimaano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Card edge connector and connector assembly thereof
- Patent number 8,435,077
- Issue date May 7, 2013
- Molex Incorporated
- Yong Teck Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Card edge connector and assembly including the same
- Patent number 8,328,567
- Issue date Dec 11, 2012
- Molex Incorporated
- Yong Teck Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical connector
- Patent number 7,934,936
- Issue date May 3, 2011
- Molex Incorporated
- Yong Teck Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES
- Publication number 20160043041
- Publication date Feb 11, 2016
- UTAC Headquarters Pte. Ltd.
- Yong Bo YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME AREA ARRAY PACKAGING TECHNOLOGY
- Publication number 20150214187
- Publication date Jul 30, 2015
- United Test and Assembly Center, Ltd.
- Antonio Bambalan Dimaano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES
- Publication number 20140264792
- Publication date Sep 18, 2014
- United Test & Assembly Center Ltd.
- Yong Bo YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME AREA ARRAY PACKAGING TECHNOLOGY
- Publication number 20140138808
- Publication date May 22, 2014
- United Test & Assembly Center Ltd.
- Antonio Bambalan Dimaano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARD EDGE CONNECTOR AND ASSEMBLY INCLUDING THE SAME
- Publication number 20120322283
- Publication date Dec 20, 2012
- Molex Incorporated
- Yong Teck Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL CONNECTOR
- Publication number 20120129376
- Publication date May 24, 2012
- Molex Incorporated
- Yong Teck Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARD EDGE CONNECTOR AND CONNECTOR ASSEMBLY THEREOF
- Publication number 20110237101
- Publication date Sep 29, 2011
- Molex Incorporated
- Yong Teck Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL CONNECTOR
- Publication number 20100062647
- Publication date Mar 11, 2010
- Molex Incorporated
- Yong Teck Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Yong Teck Yang

Person

Patents Grantslast 30 patents

Leadframe area array packaging technology

Semiconductor packages and methods of packaging semiconductor devices

Leadframe area array packaging technology

Card edge connector and connector assembly thereof

Card edge connector and assembly including the same

Electrical connector

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES

LEADFRAME AREA ARRAY PACKAGING TECHNOLOGY

SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES

LEADFRAME AREA ARRAY PACKAGING TECHNOLOGY

CARD EDGE CONNECTOR AND ASSEMBLY INCLUDING THE SAME

ELECTRICAL CONNECTOR

CARD EDGE CONNECTOR AND CONNECTOR ASSEMBLY THEREOF

ELECTRICAL CONNECTOR