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Yong-Won Cha
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Seoul, KR
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Patents Grants
last 30 patents
Information
Patent Grant
Substrate bonding apparatus
Patent number
12,027,486
Issue date
Jul 2, 2024
L TRIN.CO., LTD
Yong Won Cha
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Substrate bonding system and mobile chamber used thereto
Patent number
8,999,099
Issue date
Apr 7, 2015
Ltrin Co., Ltd.
Yong-Won Cha
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wafer cleaning method and wafer bonding method using the same
Patent number
8,278,186
Issue date
Oct 2, 2012
Ltrin Co., Ltd.
Yong Won Cha
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
DEVICE AND METHOD FOR DATA-BASED REINFORCEMENT LEARNING
Publication number
20220230097
Publication date
Jul 21, 2022
AGILESODA INC.
Yong CHA
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
SUBSTRATE BONDING APPARATUS
Publication number
20220052018
Publication date
Feb 17, 2022
L TRIN.CO.,LTD
Yong Won CHA
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
GLOBAL CONSTRUCTION BUSINESS MANAGEMENT APPARATUS, MANAGEMENT METHO...
Publication number
20180150777
Publication date
May 31, 2018
PM-Pgm Co., Ltd.
Sang-Won HAN
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
APPARATUS AND METHOD FOR BONDING SUBSTRATES
Publication number
20140322834
Publication date
Oct 30, 2014
LTrin Co., Ltd
Yong Won CHA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SUBSTRATE BONDING SYSTEM AND MOBILE CHAMBER USED THERETO
Publication number
20120298306
Publication date
Nov 29, 2012
LTRIN. CO., LTD
Yong-Won Cha
H01 - BASIC ELECTRIC ELEMENTS