Yong-Woon Yeo

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Daejeon, KR

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package comprising first molding layer and second mol...
- Patent number 12,198,997
- Issue date Jan 14, 2025
- Nepes Co., Ltd.
- Su Yun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,404,347
- Issue date Aug 2, 2022
- Nepes Co., Ltd.
- Nam Chul Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package with connection portion that passes through an encapsu...
- Patent number 11,264,330
- Issue date Mar 1, 2022
- NEPES CO., LTD.
- Yongtae Kwon
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for producing semiconductor package
- Patent number 10,804,146
- Issue date Oct 13, 2020
- NEPES LAWEH Corporation
- Nam Chul Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump for semiconductor package, semiconductor package applying the...
- Patent number 7,170,170
- Issue date Jan 30, 2007
- Nepes Co., Ltd.
- Yong-Woon Yeo
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20210398869
- Publication date Dec 23, 2021
- NEPES CO., LTD.
- Su Yun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20210151379
- Publication date May 20, 2021
- NEPES CO., LTD.
- Yongtae KWON
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20210066154
- Publication date Mar 4, 2021
- NEPES CO., LTD.
- Nam Chul Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING SEMICONDUCTOR PACKAGE
- Publication number 20190333809
- Publication date Oct 31, 2019
- NEPES CO., LTD.
- Nam Chul Kim
- H01 - BASIC ELECTRIC ELEMENTS