Yong-Zhong Hu

Person

Cupertino, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Chip packaging method and chip package unit
- Patent number 11,973,010
- Issue date Apr 30, 2024
- Richtek Technology Corporation
- Hao-Lin Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plurality of vertical heat conduction elements attached to metal film
- Patent number 11,469,162
- Issue date Oct 11, 2022
- Richtek Technology Corporation
- Hao-Lin Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor devices
- Patent number 11,183,495
- Issue date Nov 23, 2021
- Semiconductor Components Industries, LLC
- Sun-hak Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor devices
- Patent number 10,366,981
- Issue date Jul 30, 2019
- Semiconductor Components Industries, LLC
- Sun-hak Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to manufacture split gate with high density plasma oxide lay...
- Patent number 8,053,315
- Issue date Nov 8, 2011
- Alpha & Omega Semiconductor, Ltd.
- Sung-Shan Tai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CHIP PACKAGING METHOD AND CHIP PACKAGE UNIT
- Publication number 20240234264
- Publication date Jul 11, 2024
- RICHTEK TECHNOLOGY CORPORATION
- Hao-Lin Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE UNIT AND CHIP PACKAGING METHOD
- Publication number 20220367309
- Publication date Nov 17, 2022
- RICHTEK TECHNOLOGY CORPORATION
- Hao-Lin Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGING METHOD AND CHIP PACKAGE UNIT
- Publication number 20220181237
- Publication date Jun 9, 2022
- RICHTEK TECHNOLOGY CORPORATION
- Hao-Lin Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGING METHOD AND CHIP PACKAGE UNIT
- Publication number 20220181238
- Publication date Jun 9, 2022
- RICHTEK TECHNOLOGY CORPORATION
- Hao-Lin Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGING METHOD AND CHIP PACKAGE UNIT
- Publication number 20220157622
- Publication date May 19, 2022
- RICHTEK TECHNOLOGY CORPORATION
- Heng-Chi Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR DEVICES
- Publication number 20190348412
- Publication date Nov 14, 2019
- Semiconductor Components Industries, LLC
- Sun-hak LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR DEVICES
- Publication number 20160071837
- Publication date Mar 10, 2016
- Fairchild Korea Semiconductor Ltd.
- Sun-hak LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method to manufacture split gate with high density plasma oxide lay...
- Publication number 20100099230
- Publication date Apr 22, 2010
- Alpha & Omega Semiconductor, LTD.
- Sung-Shan Tai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Split gate formation with high density plasma (HDP) oxide layer as...
- Publication number 20080150013
- Publication date Jun 26, 2008
- Alpha & Omega Semiconductor, LTD.
- Sung-Shan Tai
- H01 - BASIC ELECTRIC ELEMENTS

Yong-Zhong Hu

Person

Patents Grantslast 30 patents

Chip packaging method and chip package unit

Plurality of vertical heat conduction elements attached to metal film

Power semiconductor devices

Power semiconductor devices

Method to manufacture split gate with high density plasma oxide lay...

Patents Applicationslast 30 patents

CHIP PACKAGING METHOD AND CHIP PACKAGE UNIT

CHIP PACKAGE UNIT AND CHIP PACKAGING METHOD

CHIP PACKAGING METHOD AND CHIP PACKAGE UNIT

CHIP PACKAGING METHOD AND CHIP PACKAGE UNIT

CHIP PACKAGING METHOD AND CHIP PACKAGE UNIT

POWER SEMICONDUCTOR DEVICES

POWER SEMICONDUCTOR DEVICES

Method to manufacture split gate with high density plasma oxide lay...

Split gate formation with high density plasma (HDP) oxide layer as...