Yong-Zhong Hu

Person

Hsinchu, TW

People

Patents Grantslast 30 patents

Information Patent Grant
High voltage device and manufacturing method thereof
- Patent number 12,062,570
- Issue date Aug 13, 2024
- Richtek Technology Corporation
- Kun-Huang Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Switch capable of decreasing parasitic inductance
- Patent number 11,522,536
- Issue date Dec 6, 2022
- Richtek Technology Corporation
- Kun-Huang Yu
- H03 - BASIC ELECTRONIC CIRCUITRY

Patents Applicationslast 30 patents

Information Patent Application
HIGH VOLTAGE DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240297067
- Publication date Sep 5, 2024
- RICHTEK TECHNOLOGY CORPORATION
- Kun-Huang Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NATIVE NMOS DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240105844
- Publication date Mar 28, 2024
- RICHTEK TECHNOLOGY CORPORATION
- Ying-Shiou Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED STRUCTURE OF SEMICONDUCTOR DEVICES HAVING SHARED CONTACT...
- Publication number 20240030297
- Publication date Jan 25, 2024
- RICHTEK TECHNOLOGY CORPORATION
- Chin-Chin Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH PAD STRUCTURE RESISTANT TO PLASMA DAMAGE...
- Publication number 20240014154
- Publication date Jan 11, 2024
- RICHTEK TECHNOLOGY CORPORATION
- Wu-Te WENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PIP STRUCTURE AND MANUFACTURING METHODS OF HIGH VOLTAGE DEVICE AND...
- Publication number 20230238242
- Publication date Jul 27, 2023
- RICHTEK TECHNOLOGY CORPORATION
- Chin-Chin Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND PACKAGING METHOD
- Publication number 20230163042
- Publication date May 25, 2023
- RICHTEK TECHNOLOGY CORPORATION
- Heng-Chi Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATION STRUCTURE AND HIGH THERMAL CONDUCTION ELEMENT
- Publication number 20230131821
- Publication date Apr 27, 2023
- RICHTEK TECHNOLOGY CORPORATION
- Heng-Chi Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME AND PACKAGING METHOD
- Publication number 20230098393
- Publication date Mar 30, 2023
- RICHTEK TECHNOLOGY CORPORATION
- Hao-Lin Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SWITCH CAPABLE OF DECREASING PARASITIC INDUCTANCE
- Publication number 20220224325
- Publication date Jul 14, 2022
- RICHTEK TECHNOLOGY CORPORATION
- Kun-Huang Yu
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
HIGH VOLTAGE DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20220223464
- Publication date Jul 14, 2022
- RICHTEK TECHNOLOGY CORPORATION
- Kun-Huang Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGING STRUCTURE
- Publication number 20220208628
- Publication date Jun 30, 2022
- RICHTEK TECHNOLOGY CORPORATION
- Shih-Chieh Lin
- H01 - BASIC ELECTRIC ELEMENTS

Yong-Zhong Hu

Person

Patents Grantslast 30 patents

High voltage device and manufacturing method thereof

Switch capable of decreasing parasitic inductance

Patents Applicationslast 30 patents

HIGH VOLTAGE DEVICE AND MANUFACTURING METHOD THEREOF

NATIVE NMOS DEVICE AND MANUFACTURING METHOD THEREOF

INTEGRATED STRUCTURE OF SEMICONDUCTOR DEVICES HAVING SHARED CONTACT...

SEMICONDUCTOR DEVICE WITH PAD STRUCTURE RESISTANT TO PLASMA DAMAGE...

PIP STRUCTURE AND MANUFACTURING METHODS OF HIGH VOLTAGE DEVICE AND...

PACKAGE STRUCTURE AND PACKAGING METHOD

HEAT DISSIPATION STRUCTURE AND HIGH THERMAL CONDUCTION ELEMENT

LEAD FRAME AND PACKAGING METHOD

SWITCH CAPABLE OF DECREASING PARASITIC INDUCTANCE

HIGH VOLTAGE DEVICE AND MANUFACTURING METHOD THEREOF

CHIP PACKAGING STRUCTURE