Yongdae Ha

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Asan-si, KR

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Patents Grantslast 30 patents

Information Patent Grant
Bonding head and a bonding apparatus having the same
- Patent number 11,456,273
- Issue date Sep 27, 2022
- Samsung Electronics Co., Ltd.
- Jaecheol Kim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chuck table and substrate processing system including the same
- Patent number 10,211,084
- Issue date Feb 19, 2019
- Samsung Electronics Co., Ltd.
- Doojin Kim
- B24 - GRINDING POLISHING
Information Patent Grant
Die bonding apparatus
- Patent number 9,698,117
- Issue date Jul 4, 2017
- Samsung Electronics Co., Ltd.
- Yongdae Ha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die bonding device
- Patent number 9,455,165
- Issue date Sep 27, 2016
- Samsung Electronics Co., Ltd.
- Yisung Hwang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BONDING HEAD AND A BONDING APPARATUS HAVING THE SAME
- Publication number 20200343215
- Publication date Oct 29, 2020
- Samsung Electronics Co., Ltd.
- JAECHEOL KIM
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CHUCK TABLE AND SUBSTRATE PROCESSING SYSTEM INCLUDING THE SAME
- Publication number 20170040202
- Publication date Feb 9, 2017
- Samsung Electronics Co., Ltd.
- DOOJIN KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die Bonding Device
- Publication number 20150303081
- Publication date Oct 22, 2015
- Samsung Electronics Co., Ltd.
- Yisung Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE BONDING APPARATUS
- Publication number 20150228612
- Publication date Aug 13, 2015
- Samsung Electronics Co., Ltd.
- Yongdae HA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE EJECTOR AND DIE SEPARATION METHOD
- Publication number 20140238618
- Publication date Aug 28, 2014
- Samsung Electronics Co., Ltd.
- Yisung HWANG
- H01 - BASIC ELECTRIC ELEMENTS