Yonghao AN

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San Diego, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Package comprising wire bonds configured as a heat spreader
- Patent number 11,545,411
- Issue date Jan 3, 2023
- QUALCOMM Incorporated
- Wen Yin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Specialized surface mount device for symmetric heat distribution in...
- Patent number 11,189,575
- Issue date Nov 30, 2021
- QUALCOMM Incorporated
- Supatta Niramarnkarn
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE COMPRISING WIRE BONDS CONFIGURED AS A HEAT SPREADER
- Publication number 20220037224
- Publication date Feb 3, 2022
- QUALCOMM Incorporated
- Wen YIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPECIALIZED SURFACE MOUNT DEVICE FOR SYMMETRIC HEAT DISTRIBUTION IN...
- Publication number 20210358860
- Publication date Nov 18, 2021
- QUALCOMM Incorporated
- Supatta NIRAMARNKARN
- H01 - BASIC ELECTRIC ELEMENTS