Yonghao Xiu

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Methods of promoting adhesion between underfill and conductive bump...
- Patent number 10,115,606
- Issue date Oct 30, 2018
- Intel Corporation
- Yiqun Bai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Narrow-gap flip chip underfill composition
- Patent number 9,611,372
- Issue date Apr 4, 2017
- Intel Corporation
- Yonghao Xiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for reducing underfill filler settling in integrated circuit...
- Patent number 9,431,274
- Issue date Aug 30, 2016
- Intel Corporation
- Suriyakala Ramalingam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of promoting adhesion between underfill and conductive bump...
- Patent number 9,330,993
- Issue date May 3, 2016
- Intel Corporation
- Yiqun Bai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Narrow-gap flip chip underfill composition
- Patent number 9,269,596
- Issue date Feb 23, 2016
- Intel Corporation
- Yonghao Xiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods to prevent filler entrapment in microelectronic device to m...
- Patent number 9,230,833
- Issue date Jan 5, 2016
- Intel Corporation
- Manish Dubey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods to prevent filler entrapment in microelectronic device to m...
- Patent number 8,999,765
- Issue date Apr 7, 2015
- Intel Corporation
- Manish Dubey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Epoxy-amine underfill materials for semiconductor packages
- Patent number 8,916,981
- Issue date Dec 23, 2014
- Intel Corporation
- Yonghao Xiu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PROCESSES AND METHODS FOR APPLYING UNDERFILL TO SINGULATED DIE
- Publication number 20180286704
- Publication date Oct 4, 2018
- Intel Corporation
- Elizabeth M. Nofen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCTION OF UNDERFILL FILLER SETTLING IN INTEGRATED CIRCUIT PACKAGES
- Publication number 20160343591
- Publication date Nov 24, 2016
- Intel Corporation
- Suriyakala Ramalingam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF PROMOTING ADHESION BETWEEN UNDERFILL AND CONDUCTIVE BUMP...
- Publication number 20160240395
- Publication date Aug 18, 2016
- Intel Corporation
- Yiqun Bai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NARROW-GAP FLIP CHIP UNDERFILL COMPOSITION
- Publication number 20160168351
- Publication date Jun 16, 2016
- Intel Corporation
- Yonghao Xiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NARROW-GAP FLIP CHIP UNDERFILL COMPOSITION
- Publication number 20150179478
- Publication date Jun 25, 2015
- Yonghao Xiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS TO PREVENT FILLER ENTRAPMENT IN MICROELECTRONIC DEVICE TO M...
- Publication number 20150179479
- Publication date Jun 25, 2015
- Intel Corporation
- Manish Dubey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS TO PREVENT FILLER ENTRAPMENT IN MICROELECTRONIC DEVICE TO M...
- Publication number 20140377916
- Publication date Dec 25, 2014
- Manish Dubey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EPOXY-AMINE UNDERFILL MATERIALS FOR SEMICONDUCTOR PACKAGES
- Publication number 20140332966
- Publication date Nov 13, 2014
- Yonghao Xiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCTION OF UNDERFILL FILLER SETTLING IN INTEGRATED CIRCUIT PACKAGES
- Publication number 20140177149
- Publication date Jun 26, 2014
- Suriyakala Ramalingam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF PROMOTING ADHESION BETWEEN UNDERFILL AND CONDUCTIVE BUMP...
- Publication number 20140175634
- Publication date Jun 26, 2014
- Yiqun Bai
- H01 - BASIC ELECTRIC ELEMENTS

Yonghao Xiu

Person

Patents Grantslast 30 patents

Methods of promoting adhesion between underfill and conductive bump...

Narrow-gap flip chip underfill composition

Method for reducing underfill filler settling in integrated circuit...

Methods of promoting adhesion between underfill and conductive bump...

Narrow-gap flip chip underfill composition

Methods to prevent filler entrapment in microelectronic device to m...

Methods to prevent filler entrapment in microelectronic device to m...

Epoxy-amine underfill materials for semiconductor packages

Patents Applicationslast 30 patents

PROCESSES AND METHODS FOR APPLYING UNDERFILL TO SINGULATED DIE

REDUCTION OF UNDERFILL FILLER SETTLING IN INTEGRATED CIRCUIT PACKAGES

METHODS OF PROMOTING ADHESION BETWEEN UNDERFILL AND CONDUCTIVE BUMP...

NARROW-GAP FLIP CHIP UNDERFILL COMPOSITION

NARROW-GAP FLIP CHIP UNDERFILL COMPOSITION

METHODS TO PREVENT FILLER ENTRAPMENT IN MICROELECTRONIC DEVICE TO M...

METHODS TO PREVENT FILLER ENTRAPMENT IN MICROELECTRONIC DEVICE TO M...

EPOXY-AMINE UNDERFILL MATERIALS FOR SEMICONDUCTOR PACKAGES

REDUCTION OF UNDERFILL FILLER SETTLING IN INTEGRATED CIRCUIT PACKAGES

METHODS OF PROMOTING ADHESION BETWEEN UNDERFILL AND CONDUCTIVE BUMP...