YongHee Kang

Person

Kyoungki-Do, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method of individual die bonding followed...
- Patent number 9,524,958
- Issue date Dec 20, 2016
- STATS ChipPAC Pte. Ltd.
- JoonYoung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming recesses in substrate fo...
- Patent number 8,994,048
- Issue date Mar 31, 2015
- STATS ChipPAC, Ltd.
- JoonYoung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming vertically offset conduc...
- Patent number 8,896,133
- Issue date Nov 25, 2014
- STATS ChipPAC, Ltd.
- SungWon Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming a thermally reinforced s...
- Patent number 8,786,076
- Issue date Jul 22, 2014
- STATS ChipPAC, Ltd.
- OhHan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having vertically offset bond on trace interco...
- Patent number 8,742,566
- Issue date Jun 3, 2014
- STATS ChipPAC, Ltd.
- KiYoun Jang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of forming vertically offset conduc...
- Patent number 8,492,197
- Issue date Jul 23, 2013
- STATS ChipPAC, Ltd.
- SungWon Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming vertically offset bond on trace interconnects on...
- Patent number 8,389,398
- Issue date Mar 5, 2013
- STATS ChipPAC, Ltd.
- KiYoun Jang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device having vertically offset bond on trace interco...
- Patent number 8,169,071
- Issue date May 1, 2012
- STATS ChipPAC, Ltd.
- KiYoun Jang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming vertically offset bond on trace interconnects on...
- Patent number 7,897,502
- Issue date Mar 1, 2011
- STATS ChipPAC, Ltd.
- KiYoun Jang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of forming oxide layer on signal tr...
- Patent number 7,851,345
- Issue date Dec 14, 2010
- STATS ChipPAC, Ltd.
- SeongBo Shim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Device and Method of Individual Die Bonding Followed...
- Publication number 20150001703
- Publication date Jan 1, 2015
- STATS ChipPAC, Ltd.
- JoonYoung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Vertically Offset Conduc...
- Publication number 20130234324
- Publication date Sep 12, 2013
- STATS ChipPAC, Ltd.
- SungWon Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Having Vertically Offset Bond on Trace Interco...
- Publication number 20130134586
- Publication date May 30, 2013
- STATS ChipPAC, Ltd.
- KiYoun Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming a Thermally Reinforced S...
- Publication number 20120241941
- Publication date Sep 27, 2012
- STATS ChipPAC, Ltd.
- OhHan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Having Vertically Offset Bond on Trace Interco...
- Publication number 20120181690
- Publication date Jul 19, 2012
- STATS ChipPAC, Ltd.
- KiYoun Jang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor Device and Method of Forming Recesses in Substrate fo...
- Publication number 20120146177
- Publication date Jun 14, 2012
- STATS ChipPAC, Ltd.
- JoonYoung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Vertically Offset Conduc...
- Publication number 20120043672
- Publication date Feb 23, 2012
- STATS ChipPAC, Ltd.
- SungWon Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Having Vertically Offset Bond on Trace Interco...
- Publication number 20110121452
- Publication date May 26, 2011
- STATS ChipPAC, Ltd.
- KiYoun Jang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor Device and Method of Forming Vertically Offset Bond o...
- Publication number 20100059866
- Publication date Mar 11, 2010
- STATS ChipPAC, Ltd.
- KiYoun Jang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor Device and Method of Forming Oxide Layer on Signal Tr...
- Publication number 20090236738
- Publication date Sep 24, 2009
- STATS ChipPAC, Ltd.
- SeongBo Shim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

YongHee Kang

Person

Patents Grantslast 30 patents

Semiconductor device and method of individual die bonding followed...

Semiconductor device and method of forming recesses in substrate fo...

Semiconductor device and method of forming vertically offset conduc...

Semiconductor device and method of forming a thermally reinforced s...

Semiconductor device having vertically offset bond on trace interco...

Semiconductor device and method of forming vertically offset conduc...

Method of forming vertically offset bond on trace interconnects on...

Semiconductor device having vertically offset bond on trace interco...

Method of forming vertically offset bond on trace interconnects on...

Semiconductor device and method of forming oxide layer on signal tr...

Patents Applicationslast 30 patents

Semiconductor Device and Method of Individual Die Bonding Followed...

Semiconductor Device and Method of Forming Vertically Offset Conduc...

Semiconductor Device Having Vertically Offset Bond on Trace Interco...

Semiconductor Device and Method of Forming a Thermally Reinforced S...

Semiconductor Device Having Vertically Offset Bond on Trace Interco...

Semiconductor Device and Method of Forming Recesses in Substrate fo...

Semiconductor Device and Method of Forming Vertically Offset Conduc...

Semiconductor Device Having Vertically Offset Bond on Trace Interco...

Semiconductor Device and Method of Forming Vertically Offset Bond o...

Semiconductor Device and Method of Forming Oxide Layer on Signal Tr...