YONGHOE CHO

Person

BUCHEON-SI, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Chip-stacked semiconductor package and method of manufacturing same
- Patent number 11,869,818
- Issue date Jan 9, 2024
- Samsung Electronics Co., Ltd.
- Hyoeun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,862,596
- Issue date Jan 2, 2024
- Samsung Electronics Co., Ltd.
- Namhoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including an image sensor chip and a method o...
- Patent number 11,824,076
- Issue date Nov 21, 2023
- Samsung Electronics Co., Ltd.
- Yonghoe Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,776,941
- Issue date Oct 3, 2023
- Samsung Electronics Co., Ltd.
- Yonghoe Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,552,037
- Issue date Jan 10, 2023
- Samsung Electronics Co., Ltd.
- Namhoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including an image sensor chip and a method o...
- Patent number 11,335,719
- Issue date May 17, 2022
- Samsung Electronics Co., Ltd.
- Yonghoe Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-stacked semiconductor package and method of manufacturing same
- Patent number 11,328,966
- Issue date May 10, 2022
- Samsung Electronics Co., Ltd.
- Hyoeun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 11,244,894
- Issue date Feb 8, 2022
- Samsung Electronics Co., Ltd.
- Seunghoon Yeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming redistribution lines and methods of manufacturin...
- Patent number 10,748,953
- Issue date Aug 18, 2020
- Samsung Electronics Co., Ltd.
- Yonghoe Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 10,636,760
- Issue date Apr 28, 2020
- Samsung Electronics Co., Ltd.
- Seunghoon Yeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming redistribution lines and methods of manufacturin...
- Patent number 10,615,213
- Issue date Apr 7, 2020
- Samsung Electronics Co., Ltd.
- Yonghoe Cho
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230148191
- Publication date May 11, 2023
- Samsung Electronics Co., Ltd.
- NAMHOON KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR PACKAGE AND SYSTEM HAVING THE SAME
- Publication number 20230085734
- Publication date Mar 23, 2023
- Samsung Electronics Co., Ltd.
- Sunjae KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-STACKED SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SAME
- Publication number 20220262689
- Publication date Aug 18, 2022
- Samsung Electronics Co., Ltd.
- Hyoeun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING AN IMAGE SENSOR CHIP AND A METHOD O...
- Publication number 20220254827
- Publication date Aug 11, 2022
- Samsung Electronics Co., Ltd.
- YONGHOE CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20220122955
- Publication date Apr 21, 2022
- Samsung Electronics Co., Ltd.
- YONGHOE CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20220037279
- Publication date Feb 3, 2022
- Samsung Electronics Co., Ltd.
- NAMHOON KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20210028102
- Publication date Jan 28, 2021
- Samsung Electronics Co., Ltd.
- Seunghoon Yeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING AN IMAGE SENSOR CHIP AND A METHOD O...
- Publication number 20210028217
- Publication date Jan 28, 2021
- Samsung Electronics Co., Ltd.
- YONGHOE CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-STACKED SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SAME
- Publication number 20200411393
- Publication date Dec 31, 2020
- Samsung Electronics Co., Ltd.
- Hyoeun Kim
- G01 - MEASURING TESTING
Information Patent Application
METHODS OF FORMING REDISTRIBUTION LINES AND METHODS OF MANUFACTURIN...
- Publication number 20200203414
- Publication date Jun 25, 2020
- Samsung Electronics Co., Ltd.
- YONGHOE CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20190214359
- Publication date Jul 11, 2019
- Samsung Electronics Co., Ltd.
- Seunghoon YEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING REDISTRIBUTION LINES AND METHODS OF MANUFACTURIN...
- Publication number 20190172865
- Publication date Jun 6, 2019
- Samsung Electronics Co., Ltd.
- YONGHOE CHO
- H01 - BASIC ELECTRIC ELEMENTS

YONGHOE CHO

Person

Patents Grantslast 30 patents

Chip-stacked semiconductor package and method of manufacturing same

Semiconductor package

Semiconductor package including an image sensor chip and a method o...

Semiconductor package

Semiconductor package

Semiconductor package including an image sensor chip and a method o...

Chip-stacked semiconductor package and method of manufacturing same

Semiconductor packages

Methods of forming redistribution lines and methods of manufacturin...

Semiconductor packages

Methods of forming redistribution lines and methods of manufacturin...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE

IMAGE SENSOR PACKAGE AND SYSTEM HAVING THE SAME

CHIP-STACKED SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SAME

SEMICONDUCTOR PACKAGE INCLUDING AN IMAGE SENSOR CHIP AND A METHOD O...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGES

SEMICONDUCTOR PACKAGE INCLUDING AN IMAGE SENSOR CHIP AND A METHOD O...

CHIP-STACKED SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SAME

METHODS OF FORMING REDISTRIBUTION LINES AND METHODS OF MANUFACTURIN...

SEMICONDUCTOR PACKAGES

METHODS OF FORMING REDISTRIBUTION LINES AND METHODS OF MANUFACTURIN...