YONGHWAN KWON

Person

SUWON-SI, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package
- Patent number 12,191,221
- Issue date Jan 7, 2025
- Samsung Electronics Co., Ltd.
- Yonghwan Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 12,027,432
- Issue date Jul 2, 2024
- Samsung Electronics Co., Ltd.
- Yonghwan Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out semiconductor package including under-bump metallurgy
- Patent number 11,961,792
- Issue date Apr 16, 2024
- Samsung Electronics Co., Ltd.
- Yonghwan Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display apparatus and method of controlling the same
- Patent number 11,853,640
- Issue date Dec 26, 2023
- Samsung Electronics Co., Ltd.
- Hyeonji Lee
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor package including a redistribution structure
- Patent number 11,735,571
- Issue date Aug 22, 2023
- Samsung Electronics Co., Ltd.
- Yonghwan Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 11,569,137
- Issue date Jan 31, 2023
- Samsung Electronics Co., Ltd.
- Yonghwan Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out semiconductor package including under-bump metallurgy
- Patent number 11,545,422
- Issue date Jan 3, 2023
- Samsung Electronics Co., Ltd.
- Yonghwan Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,545,440
- Issue date Jan 3, 2023
- Samsung Electronice Co., Ltd.
- Yonghwan Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display screen or portion thereof with graphical user interface
- Patent number D936089
- Issue date Nov 16, 2021
- Samsung Electronics Co., Ltd.
- Sangjoon Lee
- D14 - Recording, communication, or information retrieval equipment
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 10,734,367
- Issue date Aug 4, 2020
- Sansumg Electronics Co., Ltd.
- Seung-Kwan Ryu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 10,186,500
- Issue date Jan 22, 2019
- Samsung Electronics Co., Ltd.
- Seung-Kwan Ryu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating fan-out wafer level package and fan-out wafe...
- Patent number 9,972,605
- Issue date May 15, 2018
- Samsung Electronics Co., Ltd.
- Yonghwan Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for fabricating the same
- Patent number 9,972,580
- Issue date May 15, 2018
- Samsung Electronics Co., Ltd.
- Yonghwan Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating fan-out wafer level package and fan-out wafe...
- Patent number 9,653,372
- Issue date May 16, 2017
- Samsung Electronics Co., Ltd.
- Yonghwan Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
TV display screen displaying GUI
- Patent number D749605
- Issue date Feb 16, 2016
- Samsung Electronics Co., Ltd.
- Yoojin Choi
- D14 - Recording, communication, or information retrieval equipment
Information Patent Grant
TV display screen displaying graphical user interface
- Patent number D742900
- Issue date Nov 10, 2015
- Samsung Electronics Co., Ltd.
- Jangwon Seo
- D14 - Recording, communication, or information retrieval equipment
Information Patent Grant
TV display screen displaying GUI
- Patent number D742901
- Issue date Nov 10, 2015
- Samsung Electronics Co., Ltd.
- Yoojin Choi
- D14 - Recording, communication, or information retrieval equipment
Information Patent Grant
Semiconductor device including a solder and method of fabricating t...
- Patent number 9,159,688
- Issue date Oct 13, 2015
- Samsung Electronics Co., Ltd.
- Jong Yun Myung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having stacked solder bumps with intervening...
- Patent number 9,142,498
- Issue date Sep 22, 2015
- Samsung Electronics Co., Ltd.
- Boin Noh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
TV display screen displaying GUI
- Patent number D735739
- Issue date Aug 4, 2015
- Samsung Electronics Co., Ltd.
- Yoojin Choi
- D14 - Recording, communication, or information retrieval equipment
Information Patent Grant
TV display screen displaying GUI
- Patent number D735220
- Issue date Jul 28, 2015
- Samsung Electronics Co., Ltd.
- Jangwon Seo
- D14 - Recording, communication, or information retrieval equipment
Information Patent Grant
TV display screen displaying GUI
- Patent number D734346
- Issue date Jul 14, 2015
- Samsung Electronics Co., Ltd.
- Yoojin Choi
- D14 - Recording, communication, or information retrieval equipment
Information Patent Grant
TV display screen displaying GUI
- Patent number D734347
- Issue date Jul 14, 2015
- Samsung Electronics Co., Ltd.
- Yoojin Choi
- D14 - Recording, communication, or information retrieval equipment
Information Patent Grant
TV display screen with graphical user interface
- Patent number D733729
- Issue date Jul 7, 2015
- Samsung Electronics Co, Ltd.
- Jangwon Seo
- D14 - Recording, communication, or information retrieval equipment
Information Patent Grant
TV display screen with an animated graphical user interface
- Patent number D733726
- Issue date Jul 7, 2015
- Samsung Electronics Co., Ltd.
- Jangwon Seo
- D14 - Recording, communication, or information retrieval equipment
Information Patent Grant
TV display screen displaying GUI
- Patent number D733725
- Issue date Jul 7, 2015
- Samsung Electronics Co., Ltd.
- Jangwon Seo
- D14 - Recording, communication, or information retrieval equipment
Information Patent Grant
Package for semiconductor device including guide rings and manufact...
- Patent number 9,018,041
- Issue date Apr 28, 2015
- Samsung Electronics Co., Ltd.
- Han-shin Youn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
TV screen display with transitional graphical user interface
- Patent number D709521
- Issue date Jul 22, 2014
- Samsung Electronics Co., Ltd.
- Yoojin Choi
- D14 - Recording, communication, or information retrieval equipment
Information Patent Grant
Display screen or portion thereof with animated graphical user inte...
- Patent number D698360
- Issue date Jan 28, 2014
- Samsung Electronics Co., Ltd.
- Woo-Seok Hwang
- D14 - Recording, communication, or information retrieval equipment
Information Patent Grant
Display screen or portion thereof with animated graphical user inte...
- Patent number D697924
- Issue date Jan 21, 2014
- Samsung Electronics Co., Ltd.
- Hwang Woo-Seok
- D14 - Recording, communication, or information retrieval equipment

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240105541
- Publication date Mar 28, 2024
- Samsung Electronics Co., Ltd.
- YONGHWAN KWON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240055362
- Publication date Feb 15, 2024
- Samsung Electronics Co., Ltd.
- YONGHWAN KWON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC APPARATUS AND CONTROLLING METHOD THEREOF
- Publication number 20230400972
- Publication date Dec 14, 2023
- Samsung Electronics Co., Ltd.
- Sangjin HAN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20230290697
- Publication date Sep 14, 2023
- Samsung Electronics Co., Ltd.
- Yonghwan Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230023672
- Publication date Jan 26, 2023
- Samsung Electronics Co., Ltd.
- Yonghwan Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230005806
- Publication date Jan 5, 2023
- Samsung Electronics Co., Ltd.
- Yonghwan Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20220384322
- Publication date Dec 1, 2022
- Samsung Electronics Co., Ltd.
- Yonghwan Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT SEMICONDUCTOR PACKAGE INCLUDING UNDER-BUMP METALLURGY
- Publication number 20220102256
- Publication date Mar 31, 2022
- Samsung Electronics Co., Ltd.
- Yonghwan Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING A REDISTRIBUTION STRUCTURE
- Publication number 20220068896
- Publication date Mar 3, 2022
- Samsung Electronics Co., Ltd.
- YONGHWAN KWON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20220068731
- Publication date Mar 3, 2022
- Samsung Electronics Co., Ltd.
- Yonghwan Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY APPARATUS AND METHOD OF CONTROLLING THE SAME
- Publication number 20210208837
- Publication date Jul 8, 2021
- Samsung Electronics Co., Ltd.
- Hyeonji LEE
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20210183785
- Publication date Jun 17, 2021
- Samsung Electronics Co., Ltd.
- YONGHWAN KWON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20190164942
- Publication date May 30, 2019
- Samsung Electronics Co., Ltd.
- SEUNG-KWAN RYU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING FAN-OUT WAFER LEVEL PACKAGE AND FAN-OUT WAFE...
- Publication number 20170207201
- Publication date Jul 20, 2017
- Samsung Electronics Co., Ltd.
- YONGHWAN KWON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME
- Publication number 20170194266
- Publication date Jul 6, 2017
- Samsung Electronics Co., Ltd.
- YONGHWAN KWON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20170170154
- Publication date Jun 15, 2017
- SEUNG-KWAN RYU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING FAN-OUT WAFER LEVEL PACKAGE AND FAN-OUT WAFE...
- Publication number 20160118326
- Publication date Apr 28, 2016
- Samsung Electronics Co., Ltd.
- YONGHWAN KWON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20140217580
- Publication date Aug 7, 2014
- Samsung Electronics Co., Ltd.
- Jong Yun MYUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE FOR SEMICONDUCTOR DEVICE INCLUDING GUIDE RINGS AND MANUFACT...
- Publication number 20140051243
- Publication date Feb 20, 2014
- Samsung Electronics Co., Ltd.
- Han-shin YOUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES HAVING MULTI-BUMP ELECTRICAL INTERCONNECTIONS...
- Publication number 20140035131
- Publication date Feb 6, 2014
- Boin Noh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package For Semiconductor Device Including Guide Rings And Manufact...
- Publication number 20120074566
- Publication date Mar 29, 2012
- Samsung Electronics Co., Ltd.
- HanShin Youn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES INCLUDING CONDUCTIVE VIAS, CONDUCTIVE CAPS...
- Publication number 20110133333
- Publication date Jun 9, 2011
- SAMSUNG ELECTRONICS CO., LTD.
- Woonseong Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bump structure for a semiconductor device and method of manufacture
- Publication number 20090305494
- Publication date Dec 10, 2009
- Yonghwan Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bump structure for a semiconductor device and method of manufacture
- Publication number 20050233569
- Publication date Oct 20, 2005
- Yonghwan Kwon
- H01 - BASIC ELECTRIC ELEMENTS

YONGHWAN KWON

Person

Patents Grantslast 30 patents

Semiconductor package

Semiconductor packages

Fan-out semiconductor package including under-bump metallurgy

Display apparatus and method of controlling the same

Semiconductor package including a redistribution structure

Semiconductor packages

Fan-out semiconductor package including under-bump metallurgy

Semiconductor package

Display screen or portion thereof with graphical user interface

Semiconductor package and method of fabricating the same

Semiconductor package and method of fabricating the same

Method for fabricating fan-out wafer level package and fan-out wafe...

Semiconductor package and method for fabricating the same

Method for fabricating fan-out wafer level package and fan-out wafe...

TV display screen displaying GUI

TV display screen displaying graphical user interface

TV display screen displaying GUI

Semiconductor device including a solder and method of fabricating t...

Semiconductor devices having stacked solder bumps with intervening...

TV display screen displaying GUI

TV display screen displaying GUI

TV display screen displaying GUI

TV display screen displaying GUI

TV display screen with graphical user interface

TV display screen with an animated graphical user interface

TV display screen displaying GUI

Package for semiconductor device including guide rings and manufact...

TV screen display with transitional graphical user interface

Display screen or portion thereof with animated graphical user inte...

Display screen or portion thereof with animated graphical user inte...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

SEMICONDUCTOR PACKAGE

ELECTRONIC APPARATUS AND CONTROLLING METHOD THEREOF

SEMICONDUCTOR PACKAGES

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

FAN-OUT SEMICONDUCTOR PACKAGE INCLUDING UNDER-BUMP METALLURGY

SEMICONDUCTOR PACKAGE INCLUDING A REDISTRIBUTION STRUCTURE

SEMICONDUCTOR PACKAGES

DISPLAY APPARATUS AND METHOD OF CONTROLLING THE SAME

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

METHOD FOR FABRICATING FAN-OUT WAFER LEVEL PACKAGE AND FAN-OUT WAFE...

SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

METHOD FOR FABRICATING FAN-OUT WAFER LEVEL PACKAGE AND FAN-OUT WAFE...

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

PACKAGE FOR SEMICONDUCTOR DEVICE INCLUDING GUIDE RINGS AND MANUFACT...

SEMICONDUCTOR DEVICES HAVING MULTI-BUMP ELECTRICAL INTERCONNECTIONS...

Package For Semiconductor Device Including Guide Rings And Manufact...

MICROELECTRONIC DEVICES INCLUDING CONDUCTIVE VIAS, CONDUCTIVE CAPS...

Bump structure for a semiconductor device and method of manufacture

Bump structure for a semiconductor device and method of manufacture