Yonghwan KWON

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Yongin-si, KR

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package and method for manufacturing semiconductor pa...
- Patent number 11,996,378
- Issue date May 28, 2024
- Samsung Electronics Co., Ltd.
- Yonghwan Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including a chip pad having a connection port...
- Patent number 11,854,912
- Issue date Dec 26, 2023
- Samsung Electronics Co., Ltd.
- Joonsung Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING SEMICONDUCTOR PA...
- Publication number 20240290739
- Publication date Aug 29, 2024
- Samsung Electronics Co., Ltd.
- Yonghwan Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT SEMICONDUCTOR PACKAGE INCLUDING UNDER-BUMP METALLURGY
- Publication number 20230134276
- Publication date May 4, 2023
- SAMSUNG ELECTRONICS CO,. LTD.
- Yonghwan Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING SEMICONDUCTOR PA...
- Publication number 20220375889
- Publication date Nov 24, 2022
- Samsung Electronics Co., Ltd.
- Yonghwan Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20220068730
- Publication date Mar 3, 2022
- Samsung Electronics Co., Ltd.
- Joonsung KIM
- H01 - BASIC ELECTRIC ELEMENTS