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YongHyuk Jeong
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Kyungki-do, KR
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Patents Grants
last 30 patents
Information
Patent Grant
Semiconductor device and method of forming stacked semiconductor di...
Patent number
9,318,380
Issue date
Apr 19, 2016
STATS ChipPAC, Ltd.
YoungJoon Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit packaging system with interconnects
Patent number
9,059,108
Issue date
Jun 16, 2015
Stats Chippac Ltd.
DaeSik Choi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of forming stacked semiconductor di...
Patent number
8,816,404
Issue date
Aug 26, 2014
STATS ChipPAC, Ltd.
YoungJoon Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit packaging system with interconnects and method o...
Patent number
8,546,194
Issue date
Oct 1, 2013
Stats Chippac Ltd.
JoonYoung Choi
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Semiconductor Device and Method of Forming Stacked Semiconductor Di...
Publication number
20140322865
Publication date
Oct 30, 2014
YoungJoon Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH INTERCONNECTS AND METHOD O...
Publication number
20130221543
Publication date
Aug 29, 2013
DaeSik Choi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH INTERCONNECTS AND METHOD O...
Publication number
20130157418
Publication date
Jun 20, 2013
JoonYoung Choi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Forming Stacked Semiconductor Di...
Publication number
20130069239
Publication date
Mar 21, 2013
STATS ChipPAC, Ltd.
YoungJoon Kim
H01 - BASIC ELECTRIC ELEMENTS