Yongin LEE

Person

Seoul, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Storage device, multi-component device and method of controlling op...
- Patent number 11,971,764
- Issue date Apr 30, 2024
- Samsung Electronics Co., Ltd.
- Yongin Lee
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Storage device set including storage device and reconfigurable logi...
- Patent number 11,868,626
- Issue date Jan 9, 2024
- Samsung Electronics Co., Ltd.
- Yongin Lee
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Storage device, multi-component device and method of controlling op...
- Patent number 11,543,871
- Issue date Jan 3, 2023
- Samsung Electronics Co., Ltd.
- Yongin Lee
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Storage device set including storage device and reconfigurable logi...
- Patent number 11,474,714
- Issue date Oct 18, 2022
- Samsung Electronics Co., Ltd.
- Yongin Lee
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Bonding apparatus
- Patent number 10,784,130
- Issue date Sep 22, 2020
- Samsung Electronics Co., Ltd.
- Joong-Ha Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATE BONDING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCT...
- Publication number 20240242981
- Publication date Jul 18, 2024
- Samsung Electronics Co., Ltd.
- Sehoon JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR MEASURING AN ADHESION FORCE
- Publication number 20240234215
- Publication date Jul 11, 2024
- Samsung Electronics Co., Ltd.
- Donggap SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR MEASURING AN ADHESION FORCE
- Publication number 20240136231
- Publication date Apr 25, 2024
- Samsung Electronics Co., Ltd.
- Donggap SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA PROCESSING APPARATUS, WAFER TO WAFER BONDING SYSTEM AND WAFE...
- Publication number 20240038536
- Publication date Feb 1, 2024
- Samsung Electronics Co., Ltd.
- YONGIN LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA PROCESSING APPARATUS, SUBSTRATE BONDING SYSTEM INCLUDING THE...
- Publication number 20230215698
- Publication date Jul 6, 2023
- Samsung Electronics Co., Ltd.
- Inhwa Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STORAGE DEVICE, MULTI-COMPONENT DEVICE AND METHOD OF CONTROLLING OP...
- Publication number 20230096935
- Publication date Mar 30, 2023
- Samsung Electronics Co., Ltd.
- YONGIN LEE
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
STORAGE DEVICE SET INCLUDING STORAGE DEVICE AND RECONFIGURABLE LOGI...
- Publication number 20220413722
- Publication date Dec 29, 2022
- Samsung Electronics Co., Ltd.
- Yongin LEE
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
STORAGE DEVICE, MULTI-COMPONENT DEVICE AND METHOD OF CONTROLLING OP...
- Publication number 20220129056
- Publication date Apr 28, 2022
- Samsung Electronics Co., Ltd.
- YONGIN LEE
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
STORAGE DEVICE SET INCLUDING STORAGE DEVICE AND RECONFIGURABLE LOGI...
- Publication number 20210173571
- Publication date Jun 10, 2021
- Samsung Electronics Co., Ltd.
- Yongin LEE
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
BONDING APPARATUS
- Publication number 20180174871
- Publication date Jun 21, 2018
- Samsung Electronics Co., Ltd.
- Joong-Ha LEE
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Storage device, multi-component device and method of controlling op...

Storage device set including storage device and reconfigurable logi...

Storage device, multi-component device and method of controlling op...

Storage device set including storage device and reconfigurable logi...

Bonding apparatus

Patents Applicationslast 30 patents

SUBSTRATE BONDING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCT...

APPARATUS FOR MEASURING AN ADHESION FORCE

APPARATUS FOR MEASURING AN ADHESION FORCE

PLASMA PROCESSING APPARATUS, WAFER TO WAFER BONDING SYSTEM AND WAFE...

PLASMA PROCESSING APPARATUS, SUBSTRATE BONDING SYSTEM INCLUDING THE...

STORAGE DEVICE, MULTI-COMPONENT DEVICE AND METHOD OF CONTROLLING OP...

STORAGE DEVICE SET INCLUDING STORAGE DEVICE AND RECONFIGURABLE LOGI...

STORAGE DEVICE, MULTI-COMPONENT DEVICE AND METHOD OF CONTROLLING OP...

STORAGE DEVICE SET INCLUDING STORAGE DEVICE AND RECONFIGURABLE LOGI...

BONDING APPARATUS