Yongje LEE

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Suwon-si, KR

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Patents Grantslast 30 patents

Information Patent Grant
Wire bonding method for semiconductor package
- Patent number 11,594,503
- Issue date Feb 28, 2023
- Samsung Electronics Co., Ltd.
- Hosoo Han
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC DEVICE FOR OPERATING SECURITY DEVICE, AND OPERATING METH...
- Publication number 20240356924
- Publication date Oct 24, 2024
- Samsung Electronics Co., Ltd.
- Donghyun CHO
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
WIRE BONDING METHOD FOR SEMICONDUCTOR PACKAGE
- Publication number 20210358873
- Publication date Nov 18, 2021
- Samsung Electronics Co., Ltd.
- Hosoo HAN
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR