Yongjin JUNG

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Asan-si, KR

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Patents Grantslast 30 patents

Information Patent Grant
Die bonding apparatus
- Patent number 9,698,117
- Issue date Jul 4, 2017
- Samsung Electronics Co., Ltd.
- Yongdae Ha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package which includes an insulating layer located be...
- Patent number 7,989,939
- Issue date Aug 2, 2011
- Samsung Electronics Co., Ltd.
- Hyun-Ik Hwang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DIE BONDING APPARATUS
- Publication number 20150228612
- Publication date Aug 13, 2015
- Samsung Electronics Co., Ltd.
- Yongdae HA
- H01 - BASIC ELECTRIC ELEMENTS