Yongmei Liu

Person

Gilbert, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated heat spreader (IHS) with heating element
- Patent number 11,798,861
- Issue date Oct 24, 2023
- Intel Corporation
- Peng Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies including a thermal interface material
- Patent number 11,791,237
- Issue date Oct 17, 2023
- Intel Corporation
- Peng Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal interface apparatus, systems, and fabrication methods
- Patent number 7,317,258
- Issue date Jan 8, 2008
- Intel Corporation
- Rajen C. Dias
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Grant
Thermal interface apparatus, systems, and fabrication methods
- Patent number 7,042,729
- Issue date May 9, 2006
- Intel Corporation
- Rajen C. Dias
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED HEAT SPREADER (IHS) WITH HEATING ELEMENT
- Publication number 20210013117
- Publication date Jan 14, 2021
- Intel Corporation
- Peng Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES INCLUDING A THERMAL INTERFACE MATERIAL
- Publication number 20200006192
- Publication date Jan 2, 2020
- Intel Corporation
- Peng Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEASURING SURFACE LAYER THICKNESS
- Publication number 20170176173
- Publication date Jun 22, 2017
- Intel Corporation
- Yanmei Song
- G01 - MEASURING TESTING
Information Patent Application
THERMAL INTERFACE APPARATUS, SYSTEMS, AND FABRICATION METHODS
- Publication number 20080005886
- Publication date Jan 10, 2008
- Intel Corporation
- Rajen C. Dias
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Application
Thermal interface apparatus, systems, and fabrication methods
- Publication number 20060146501
- Publication date Jul 6, 2006
- Intel Corporation
- Rajen C. Dias
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Application
Method of fabricating microelectronic package using no-flow underfi...
- Publication number 20060068521
- Publication date Mar 30, 2006
- Song-Hua Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermal Interface Apparatus, Systems, and Fabrication methods
- Publication number 20040264138
- Publication date Dec 30, 2004
- Intel Corporation
- Rajen C. Dias
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...

Yongmei Liu

Person

Patents Grantslast 30 patents

Integrated heat spreader (IHS) with heating element

Microelectronic assemblies including a thermal interface material

Thermal interface apparatus, systems, and fabrication methods

Thermal interface apparatus, systems, and fabrication methods

Patents Applicationslast 30 patents

INTEGRATED HEAT SPREADER (IHS) WITH HEATING ELEMENT

MICROELECTRONIC ASSEMBLIES INCLUDING A THERMAL INTERFACE MATERIAL

MEASURING SURFACE LAYER THICKNESS

THERMAL INTERFACE APPARATUS, SYSTEMS, AND FABRICATION METHODS

Thermal interface apparatus, systems, and fabrication methods

Method of fabricating microelectronic package using no-flow underfi...

Thermal Interface Apparatus, Systems, and Fabrication methods