YongMin Kim

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Incheon-si, KR

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method of forming hybrid TIM layers
- Patent number 12,125,764
- Issue date Oct 22, 2024
- STATS ChipPAC Pte. Ltd.
- TaeKeun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with windowed heat spreader
- Patent number 11,830,785
- Issue date Nov 28, 2023
- STATS ChipPAC Pte. Ltd.
- TaeKeun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming hybrid TIM layers
- Patent number 11,735,489
- Issue date Aug 22, 2023
- STATS ChipPAC Pte. Ltd.
- TaeKeun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System-in-package with double-sided molding
- Patent number 11,670,618
- Issue date Jun 6, 2023
- STATS ChipPAC Pte. Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System-in-package with double-sided molding
- Patent number 10,797,024
- Issue date Oct 6, 2020
- STATS ChipPAC Pte. Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System-in-package with double-sided molding
- Patent number 10,636,765
- Issue date Apr 28, 2020
- STATS ChipPAC Pte. Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Device and Method of Forming Hybrid TIM Layers
- Publication number 20230352359
- Publication date Nov 2, 2023
- STATS ChipPAC Pte Ltd.
- TaeKeun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package with Windowed Heat Spreader
- Publication number 20230118190
- Publication date Apr 20, 2023
- STATS ChipPAC Pte Ltd.
- TaeKeun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Hybrid TIM Layers
- Publication number 20220406675
- Publication date Dec 22, 2022
- STATS ChipPAC Pte Ltd.
- TaeKeun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System-in-Package with Double-Sided Molding
- Publication number 20200402955
- Publication date Dec 24, 2020
- STATS ChipPAC Pte Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System-in-Package with Double-Sided Molding
- Publication number 20200219847
- Publication date Jul 9, 2020
- STATS ChipPAC Pte Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System -in-Package with Double-Sided Molding
- Publication number 20180269181
- Publication date Sep 20, 2018
- STATS ChipPAC Pte Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS