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YongMoo SHIN
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Incheon, KR
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last 30 patents
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Patent Application
Semiconductor Device and Method of Forming an Antenna-in-Package St...
Publication number
20250038058
Publication date
Jan 30, 2025
JCET STATS ChipPAC Korea Limited
SeungHyun LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Making Redistribution Layers wit...
Publication number
20250022792
Publication date
Jan 16, 2025
STATS ChipPAC Pte Ltd.
YongMoo Shin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Making an EMI Shield Using Inten...
Publication number
20240413095
Publication date
Dec 12, 2024
STATS ChipPAC Pte Ltd.
YongMoo Shin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE WITH IMPROVED HEAT DISSIPATION
Publication number
20240404911
Publication date
Dec 5, 2024
JCET STATS ChipPAC Korea Limited
SeungHyun LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Making a Dual-Side Molded System...
Publication number
20240379480
Publication date
Nov 14, 2024
STATS ChipPAC Pte Ltd.
YongMoo Shin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Forming Interconnect Structure w...
Publication number
20240332035
Publication date
Oct 3, 2024
STATS ChipPAC Pte Ltd.
YongMoo Shin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE WITH IMPROVED HEAT DISSIPATION AND METHOD FOR...
Publication number
20240332114
Publication date
Oct 3, 2024
JCET STATS ChipPAC Korea Limited
SeungHyun LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Partial Shielding with Embedded...
Publication number
20240321768
Publication date
Sep 26, 2024
STATS ChipPAC Pte Ltd.
YongMoo Shin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Forming Fine Pitch Conductive Po...
Publication number
20240312884
Publication date
Sep 19, 2024
STATS ChipPAC Pte Ltd.
YongMoo Shin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Forming RDL with Graphene-Coated...
Publication number
20240234291
Publication date
Jul 11, 2024
STATS ChipPAC Pte Ltd.
YongMoo Shin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Making a Semiconductor Package w...
Publication number
20240234292
Publication date
Jul 11, 2024
STATS ChipPAC Pte Ltd.
YongMoo Shin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Die Attach with Adhesive Layer C...
Publication number
20240194628
Publication date
Jun 13, 2024
STATS ChipPAC Pte Ltd.
YongMoo Shin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Making a Semiconductor Package w...
Publication number
20240194629
Publication date
Jun 13, 2024
STATS ChipPAC Pte Ltd.
YongMoo Shin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Forming Graphene Core Shell Embe...
Publication number
20240128200
Publication date
Apr 18, 2024
STATS ChipPAC Pte Ltd.
YongMoo Shin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Forming Graphene-Coated Core Emb...
Publication number
20240096736
Publication date
Mar 21, 2024
STATS ChipPAC Pte Ltd.
YongMoo Shin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MAKING THE SAME
Publication number
20230260881
Publication date
Aug 17, 2023
STATS ChipPAC Pte Ltd.
HyunSeok PARK
H01 - BASIC ELECTRIC ELEMENTS