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Yongqian GAO

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  • Santa Clara, CA, US
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Patents Applicationslast 30 patents

  • Information Patent Application

    MITIGATION OF FIRST WAFER EFFECT
    • Publication number 20240379343
    • Publication date Nov 14, 2024
    • Applied Materials, Inc.
    • Yongqian Gao
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    HYDROGEN PLASMA TREATMENT FOR FORMING LOGIC DEVICES
    • Publication number 20240304495
    • Publication date Sep 12, 2024
    • Applied Materials, Inc.
    • Tsung-Han Yang
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Application

    LOW RESISTIVITY GAPFILL FOR LOGIC DEVICES
    • Publication number 20240240314
    • Publication date Jul 18, 2024
    • Applied Materials, Inc.
    • Zhen Liu
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Application

    LOW RESISTIVITY GAPFILL
    • Publication number 20240175120
    • Publication date May 30, 2024
    • Applied Materials, Inc.
    • Tsung-Han Yang
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Application

    NITROGEN PLASMA TREATMENT FOR BOTTOM-UP GROWTH
    • Publication number 20240014072
    • Publication date Jan 11, 2024
    • Applied Materials, Inc.
    • Tsung-Han YANG
    • H01 - BASIC ELECTRIC ELEMENTS