Yongsheng Liu

Person

San Jose, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Flex-less multilayer ceramic substrate
- Patent number 9,900,974
- Issue date Feb 20, 2018
- Finisar Corporation
- Wenhua Ling
- G02 - OPTICS
Information Patent Grant
3-D integrated package
- Patent number 9,437,912
- Issue date Sep 6, 2016
- Finisar Corporation
- Yunpeng Song
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
3-D integrated package
- Patent number 9,013,891
- Issue date Apr 21, 2015
- Finisar Corporation
- Yunpeng Song
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Liquid crystal device and method for optical performance monitoring...
- Patent number 7,298,428
- Issue date Nov 20, 2007
- Avanex Corporation
- Haijun Yuan
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Apparatus and system for a re-configurable channel dropping de-mult...
- Patent number 7,102,821
- Issue date Sep 5, 2006
- Avonex Corporation
- Yongsheng Liu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
MEMS see-saw array for dynamic gain equalization of DWDM systems
- Patent number 6,556,766
- Issue date Apr 29, 2003
- Avanex Corporation
- Eric Chiu Tat Cheung
- G02 - OPTICS
Information Patent Grant
Manual variable optical attenuator and method
- Patent number 6,529,673
- Issue date Mar 4, 2003
- Avanex Corporation
- Yongsheng Liu
- G02 - OPTICS
Information Patent Grant
Piezo-actuator based optical add/drop module
- Patent number 6,437,929
- Issue date Aug 20, 2002
- Avanex Corporation
- Yongsheng Liu
- G02 - OPTICS

Patents Applicationslast 30 patents

Information Patent Application
FLEX-LESS MULTILAYER CERAMIC SUBSTRATE
- Publication number 20170354026
- Publication date Dec 7, 2017
- Finisar Corporation
- Wenhua Ling
- G02 - OPTICS
Information Patent Application
3-D INTEGRATED PACKAGE
- Publication number 20160013536
- Publication date Jan 14, 2016
- Finisar Corporation
- Yunpeng SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3-D INTEGRATED PACKAGE
- Publication number 20130235542
- Publication date Sep 12, 2013
- Finisar Corporation
- Yunpeng SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMS see-saw array for dynamic gain equalization of DWDM systems
- Publication number 20020197009
- Publication date Dec 26, 2002
- Eric Chiu Tat Cheung
- G02 - OPTICS

Yongsheng Liu

Person

Patents Grantslast 30 patents

Flex-less multilayer ceramic substrate

3-D integrated package

3-D integrated package

Liquid crystal device and method for optical performance monitoring...

Apparatus and system for a re-configurable channel dropping de-mult...

MEMS see-saw array for dynamic gain equalization of DWDM systems

Manual variable optical attenuator and method

Piezo-actuator based optical add/drop module

Patents Applicationslast 30 patents

FLEX-LESS MULTILAYER CERAMIC SUBSTRATE

3-D INTEGRATED PACKAGE

3-D INTEGRATED PACKAGE

MEMS see-saw array for dynamic gain equalization of DWDM systems