Yongsheng Peng

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San Diego, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Modular surface mount package for a system on a chip
- Patent number 8,737,080
- Issue date May 27, 2014
- QUALCOMM Incorporated
- Yang Zhang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for wireless phone transmit power amplificatio...
- Patent number 6,313,698
- Issue date Nov 6, 2001
- QUALCOMM Incorporated
- Yang Zhang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Patents Applicationslast 30 patents

Information Patent Application
SMART PHONE ON A CHIP AND METHOD MAKING SAME
- Publication number 20140254101
- Publication date Sep 11, 2014
- QUALCOMM Incorporated
- Mark A. CARTER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULAR SURFACE MOUNT PACKAGE FOR A SYSTEM ON A CHIP
- Publication number 20120182699
- Publication date Jul 19, 2012
- QUALCOMM Incorporated
- Yang Zhang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR