Yongsik Yu

Person

Lake Oswego, OR, US

People

Patents Grantslast 30 patents

Information Patent Grant
Metal-containing passivation for high aspect ratio etch
- Patent number 11,670,516
- Issue date Jun 6, 2023
- Lam Research Corporation
- Karthik S. Colinjivadi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal doped carbon based hard mask removal in semiconductor fabrica...
- Patent number 11,062,897
- Issue date Jul 13, 2021
- Lam Research Corporation
- Yongsik Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Staircase encapsulation in 3D NAND fabrication
- Patent number 10,580,690
- Issue date Mar 3, 2020
- Lam Research Corporation
- Yongsik Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Staircase encapsulation in 3D NAND fabrication
- Patent number 10,002,787
- Issue date Jun 19, 2018
- Lam Research Corporation
- Yongsik Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Diffusion barrier and etch stop films
- Patent number 8,669,181
- Issue date Mar 11, 2014
- Novellus Systems, Inc.
- Yongsik Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protective self-aligned buffer layers for damascene interconnects
- Patent number 8,317,923
- Issue date Nov 27, 2012
- Novellus Systems, Inc.
- Kaushik Chattopadhyay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protective self-aligned buffer layers for damascene interconnects
- Patent number 8,021,486
- Issue date Sep 20, 2011
- Novellus Systems, Inc.
- Yongsik Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of depositing stable and hermetic ashable hardmask films
- Patent number 7,981,777
- Issue date Jul 19, 2011
- Novellus Systems, Inc.
- Pramod Subramonium
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Low-K SiC copper diffusion barrier films
- Patent number 7,968,436
- Issue date Jun 28, 2011
- Novellus Systems, Inc.
- Yongsik Yu
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Diffusion barrier and etch stop films
- Patent number 7,915,166
- Issue date Mar 29, 2011
- Novellus Systems, Inc.
- Yongsik Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low-k b-doped SiC copper diffusion barrier films
- Patent number 7,842,604
- Issue date Nov 30, 2010
- Novellus Systems, Inc.
- Yongsik Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protective self-aligned buffer layers for damascene interconnects
- Patent number 7,727,880
- Issue date Jun 1, 2010
- Novellus Systems, Inc.
- Kaushik Chattopadhyay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protective self-aligned buffer layers for damascene interconnects
- Patent number 7,704,873
- Issue date Apr 27, 2010
- Novellus Systems, Inc.
- Yongsik Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protective self-aligned buffer layers for damascene interconnects
- Patent number 7,576,006
- Issue date Aug 18, 2009
- Novellus Systems, Inc.
- Yongsik Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low-k SiC copper diffusion barrier films
- Patent number 7,573,061
- Issue date Aug 11, 2009
- Novellus Systems, Inc.
- Yongsik Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Boron-doped SIC copper diffusion barrier films
- Patent number 7,420,275
- Issue date Sep 2, 2008
- Novellus Systems, Inc.
- Yongsik Yu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Low-k SiC copper diffusion barrier films
- Patent number 7,282,438
- Issue date Oct 16, 2007
- Novellus Systems, Inc.
- Yongsik Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low-k B-doped SiC copper diffusion barrier films
- Patent number 7,239,017
- Issue date Jul 3, 2007
- Novellus Systems, Inc.
- Yongsik Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Film for copper diffusion barrier
- Patent number 7,163,889
- Issue date Jan 16, 2007
- Novellus Systems, Inc.
- Yongsik Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Film for copper diffusion barrier
- Patent number 6,967,405
- Issue date Nov 22, 2005
- Yongsik Yu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METAL-CONTAINING PASSIVATION FOR HIGH ASPECT RATIO ETCH
- Publication number 20210242032
- Publication date Aug 5, 2021
- LAM RESEARCH CORPORATION
- Karthik S. COLINJIVADI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL DOPED CARBON BASED HARD MASK REMOVAL IN SEMICONDUCTOR FABRICA...
- Publication number 20180358220
- Publication date Dec 13, 2018
- LAM RESEARCH CORPORATION
- Yongsik Yu
- C01 - INORGANIC CHEMISTRY
Information Patent Application
STAIRCASE ENCAPSULATION IN 3D NAND FABRICATION
- Publication number 20180330985
- Publication date Nov 15, 2018
- LAM RESEARCH CORPORATION
- Yongsik Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STAIRCASE ENCAPSULATION IN 3D NAND FABRICATION
- Publication number 20180144977
- Publication date May 24, 2018
- LAM RESEARCH CORPORATION
- Yongsik Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Novel film for copper diffusion barrier
- Publication number 20060019486
- Publication date Jan 26, 2006
- Novellus Systems, Inc.
- Yongsik Yu
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Metal-containing passivation for high aspect ratio etch

Metal doped carbon based hard mask removal in semiconductor fabrica...

Staircase encapsulation in 3D NAND fabrication

Staircase encapsulation in 3D NAND fabrication

Diffusion barrier and etch stop films

Protective self-aligned buffer layers for damascene interconnects

Protective self-aligned buffer layers for damascene interconnects

Methods of depositing stable and hermetic ashable hardmask films

Low-K SiC copper diffusion barrier films

Diffusion barrier and etch stop films

Low-k b-doped SiC copper diffusion barrier films

Protective self-aligned buffer layers for damascene interconnects

Protective self-aligned buffer layers for damascene interconnects

Protective self-aligned buffer layers for damascene interconnects

Low-k SiC copper diffusion barrier films

Boron-doped SIC copper diffusion barrier films

Low-k SiC copper diffusion barrier films

Low-k B-doped SiC copper diffusion barrier films

Film for copper diffusion barrier

Film for copper diffusion barrier

Patents Applicationslast 30 patents

METAL-CONTAINING PASSIVATION FOR HIGH ASPECT RATIO ETCH

METAL DOPED CARBON BASED HARD MASK REMOVAL IN SEMICONDUCTOR FABRICA...

STAIRCASE ENCAPSULATION IN 3D NAND FABRICATION

STAIRCASE ENCAPSULATION IN 3D NAND FABRICATION

Novel film for copper diffusion barrier