Yongtae KWON

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Cheongju-si, KR

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Patents Grantslast 30 patents

Information Patent Grant
Chip package with connection portion that passes through an encapsu...
- Patent number 11,264,330
- Issue date Mar 1, 2022
- NEPES CO., LTD.
- Yongtae Kwon
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20210151379
- Publication date May 20, 2021
- NEPES CO., LTD.
- Yongtae KWON
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR PACKAGE OF USING INSULATING FRAME
- Publication number 20190295944
- Publication date Sep 26, 2019
- NEPES CO., LTD.
- Yongtae KWON
- H01 - BASIC ELECTRIC ELEMENTS