YONGWON CHOI

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HWASEONG-SI, KR

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor chip, semiconductor device, and semiconductor package...
- Patent number 11,784,168
- Issue date Oct 10, 2023
- Samsung Electronics Co., Ltd.
- Yongwon Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive film, semiconductor apparatus using the same, and semicond...
- Patent number 11,355,413
- Issue date Jun 7, 2022
- Samsung Electronics Co., Ltd.
- Joungphil Lee
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Semiconductor chip, semiconductor device, and semiconductor package...
- Patent number 11,342,310
- Issue date May 24, 2022
- Samsung Electronics Co., Ltd.
- Yongwon Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip bonding method
- Patent number 10,910,339
- Issue date Feb 2, 2021
- Samsung Electronics Co., Ltd.
- Hwail Jin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR CHIP, SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR PACKAGE...
- Publication number 20220278079
- Publication date Sep 1, 2022
- Samsung Electronics Co., Ltd.
- Yongwon Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL CONDUCTIVE FILM
- Publication number 20220246491
- Publication date Aug 4, 2022
- Samsung Electronics Co., Ltd.
- Joungphil LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP, SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR PACKAGE...
- Publication number 20210384162
- Publication date Dec 9, 2021
- Samsung Electronics Co., Ltd.
- Yongwon Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE FILM, SEMICONDUCTOR APPARATUS USING THE SAME, AND SEMICOND...
- Publication number 20200211920
- Publication date Jul 2, 2020
- Samsung Electronics Co., Ltd.
- Joungphil LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP BONDING METHOD
- Publication number 20200058615
- Publication date Feb 20, 2020
- Samsung Electronics Co., Ltd.
- HWAIL JIN
- H01 - BASIC ELECTRIC ELEMENTS