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Hangzhou (Xiasha), CN
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Patents Grants
last 30 patents
Information
Patent Grant
MEMS device and manufacturing method thereof
Patent number
11,305,985
Issue date
Apr 19, 2022
HANGZHOU SILAN INTEGRATED CIRCUIT CO., LTD.
Wei Sun
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
MEMS microphone and manufacturing method thereof
Patent number
11,212,611
Issue date
Dec 28, 2021
HANGZHOU SILAN INTEGRATED CIRCUIT CO., LTD.
Yongxiang Wen
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
MEMS assembly and manufacturing method thereof
Patent number
11,161,734
Issue date
Nov 2, 2021
HANGZHOU SILAN INTEGRATED CIRCUITS CO., LTD.
Yongxiang Wen
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Isolation structure and manufacturing method thereof for high-volta...
Patent number
10,770,340
Issue date
Sep 8, 2020
Hangzhou Silan Integrated Circuit Co., Ltd.
Yongxiang Wen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multiple silicon trenches forming method for MEMS sealing cap wafer...
Patent number
10,513,431
Issue date
Dec 24, 2019
Hangzhou Silan Integrated Circuit Co., Ltd.
Yongxiang Wen
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Multiple silicon trenches forming method for MEMS sealing cap wafer...
Patent number
10,081,541
Issue date
Sep 25, 2018
Hangzhou Silan Integrated Circuit Co., Ltd.
Yongxiang Wen
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Isolation structure and manufacturing method thereof for high-volta...
Patent number
9,824,913
Issue date
Nov 21, 2017
Hangzhou Silan Integrated Circuit Co., Ltd.
Yongxiang Wen
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
MEMS MICROPHONE AND MANUFACTURING METHOD THEREOF
Publication number
20210168497
Publication date
Jun 3, 2021
Hangzhou Silan Integrated Circuit Co., Ltd.
Yongxiang Wen
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
MEMS DEVICE AND MANUFACTURING METHOD THEREOF
Publication number
20200391996
Publication date
Dec 17, 2020
Hangzhou Silan Integrated Circuit Co., Ltd.
Wei Sun
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
MEMS ASSEMBLY AND MANUFACTURING METHOD THEREOF
Publication number
20200255286
Publication date
Aug 13, 2020
Hangzhou Silan Integrated Circuits Co.,Ltd.
Yongxiang Wen
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
MULTIPLE SILICON TRENCHES FORMING METHOD FOR MEMS SEALING CAP WAFER...
Publication number
20180362339
Publication date
Dec 20, 2018
HANGZHOU SILAN INTEGRATED CIRCUIT CO., LTD
Yongxiang Wen
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
ISOLATION STRUCTURE AND MANUFACTURING METHOD THEREOF FOR HIGH-VOLTA...
Publication number
20180033676
Publication date
Feb 1, 2018
HANGZHOU SILAN INTEGRATED CIRCUIT CO., LTD
Yongxiang Wen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MEMS DEVICE, SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE...
Publication number
20170081176
Publication date
Mar 23, 2017
HANGZHOU SILAN MICROELECTRONICS CO., LTD.
Feng JI
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
ISOLATION STRUCTURE AND MANUFACTURING METHOD THEREOF FOR HIGH-VOLTA...
Publication number
20150179497
Publication date
Jun 25, 2015
HANGZHOU SILAN MICROELECTRONICS CO., LTD.
Yongxiang Wen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTIPLE SILICON TRENCHES FORMING METHOD FOR MEMS SEALING CAP WAFER...
Publication number
20150091140
Publication date
Apr 2, 2015
HANGZHOU SILAN INTEGRATED CIRCUIT CO., LTD
Yongxiang Wen
B81 - MICRO-STRUCTURAL TECHNOLOGY