Yongyong He

Person

Beijing, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Device for globally measuring thickness of metal film
- Patent number 9,377,286
- Issue date Jun 28, 2016
- Tsinghua University
- Xinchun Lu
- G01 - MEASURING TESTING
Information Patent Grant
Method for measuring thickness of film on wafer edge
- Patent number 9,255,780
- Issue date Feb 9, 2016
- HWATSING TECHNOLOGY CO., LTD.
- Xinchun Lu
- B24 - GRINDING POLISHING
Information Patent Grant
Chemical mechanical polishing machine and chemical mechanical polis...
- Patent number 9,138,857
- Issue date Sep 22, 2015
- HWATSING TECHNOLOGY CO., LTD.
- Xinchun Lu
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
DEVICE FOR GLOBALLY MEASURING THICKNESS OF METAL FILM
- Publication number 20140062468
- Publication date Mar 6, 2014
- TSINGHUA UNIVERSITY
- Xinchun Lu
- G01 - MEASURING TESTING
Information Patent Application
WAFER TRANSFER DEVICE FOR CHEMICAL MECHANICAL POLISHING APPARATUS
- Publication number 20130273819
- Publication date Oct 17, 2013
- Xinchun Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MEASURING THICKNESS OF FILM ON WAFER EDGE
- Publication number 20130211765
- Publication date Aug 15, 2013
- TSINGHUA UNIVERSITY
- Xinchun Lu
- G01 - MEASURING TESTING
Information Patent Application
CHEMICAL MECHANICAL POLISHING MACHINE AND CHEMICAL MECHANICAL POLIS...
- Publication number 20130130601
- Publication date May 23, 2013
- Xinchun Lu
- B24 - GRINDING POLISHING
Information Patent Application
Device and Method for Measuring Thickness of Slurry and Chemical Me...
- Publication number 20130000845
- Publication date Jan 3, 2013
- TSINGHUA UNIVERSITY
- Xinchun Lu
- G01 - MEASURING TESTING
Information Patent Application
Device and Method for Measuring Physical Parameters of Slurry and C...
- Publication number 20120315826
- Publication date Dec 13, 2012
- Xinchun Lu
- B24 - GRINDING POLISHING
Information Patent Application
PAD CONDITIONER HEAD FOR CONDITIONING A POLISHING PAD
- Publication number 20120115403
- Publication date May 10, 2012
- Xinchun Lu
- B24 - GRINDING POLISHING

Yongyong He

Person

Patents Grantslast 30 patents

Device for globally measuring thickness of metal film

Method for measuring thickness of film on wafer edge

Chemical mechanical polishing machine and chemical mechanical polis...

Patents Applicationslast 30 patents

DEVICE FOR GLOBALLY MEASURING THICKNESS OF METAL FILM

WAFER TRANSFER DEVICE FOR CHEMICAL MECHANICAL POLISHING APPARATUS

METHOD FOR MEASURING THICKNESS OF FILM ON WAFER EDGE

CHEMICAL MECHANICAL POLISHING MACHINE AND CHEMICAL MECHANICAL POLIS...

Device and Method for Measuring Thickness of Slurry and Chemical Me...

Device and Method for Measuring Physical Parameters of Slurry and C...

PAD CONDITIONER HEAD FOR CONDITIONING A POLISHING PAD