Yoo Rim CHA

Follow

Person

Suwon-Si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Electronic component embedded substrate
- Patent number 11,640,952
- Issue date May 2, 2023
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Mi Sun Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,532,572
- Issue date Dec 20, 2022
- Samsung Electronics Co., Ltd.
- Yoo Rim Cha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate having electronic component embedded therein
- Patent number 11,183,462
- Issue date Nov 23, 2021
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Mi Sun Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,075,175
- Issue date Jul 27, 2021
- Samsung Electronics Co., Ltd.
- Yoo Rim Cha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out semiconductor package module
- Patent number 10,833,070
- Issue date Nov 10, 2020
- Samsung Electronics Co., Ltd.
- Jung Chul Gong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out semiconductor package module
- Patent number 10,403,562
- Issue date Sep 3, 2019
- Samsung Electronics Co., Ltd.
- Yong Ho Baek
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20210327832
- Publication date Oct 21, 2021
- Samsung Electronics Co., Ltd.
- Yoo Rim CHA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT EMBEDDED SUBSTRATE
- Publication number 20210193609
- Publication date Jun 24, 2021
- Samsung Electro-Mechanics Co., Ltd.
- Mi Sun HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE HAVING ELECTRONIC COMPONENT EMBEDDED THEREIN
- Publication number 20210183784
- Publication date Jun 17, 2021
- Samsung Electro-Mechanics Co., Ltd.
- Mi Sun HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20200051933
- Publication date Feb 13, 2020
- Samsung Electronics Co., Ltd.
- Yoo Rim CHA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT SEMICONDUCTOR PACKAGE MODULE
- Publication number 20190273079
- Publication date Sep 5, 2019
- Samsung Electronics Co., Ltd.
- Jung Chul GONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT SEMICONDUCTOR PACKAGE MODULE
- Publication number 20190131212
- Publication date May 2, 2019
- Samsung Electro-Mechanics Co., Ltd.
- Yong Ho BAEK
- H01 - BASIC ELECTRIC ELEMENTS