Yoong Oh

Person

Suwon-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Printed circuit board
- Patent number 12,224,235
- Issue date Feb 11, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Chan Hoon Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board
- Patent number 11,297,714
- Issue date Apr 5, 2022
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Young-Kuk Ko
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package substrate
- Patent number 11,088,089
- Issue date Aug 10, 2021
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Yoong Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board and package structure having the same
- Patent number 10,991,647
- Issue date Apr 27, 2021
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Yoong Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board
- Patent number 10,849,225
- Issue date Nov 24, 2020
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Young-Kuk Ko
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and method of manufacturing the same
- Patent number 9,736,927
- Issue date Aug 15, 2017
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Suk Hyeon Cho
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and method of manufacturing printed circuit b...
- Patent number 9,736,939
- Issue date Aug 15, 2017
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Suk Hyeon Cho
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing multi-layer printed circuit board
- Patent number 9,060,458
- Issue date Jun 16, 2015
- Samsung Electro-Mechanics Co., Ltd.
- Yoong Oh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for manufacturing printed circuit board
- Patent number 8,151,446
- Issue date Apr 10, 2012
- Samsung Electro-Mechanics Co., Ltd.
- Jee-Soo Mok
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Printed circuit board using paste bump and manufacturing method the...
- Patent number 7,973,248
- Issue date Jul 5, 2011
- Samsung Electro-Mechanics Co., Ltd.
- Jee-Soo Mok
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer printed circuit board using paste bumps
- Patent number 7,859,106
- Issue date Dec 28, 2010
- Samsung Electro-Mechanics Co., Ltd.
- Yoong Oh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for fabricating core substrate using paste bumps
- Patent number 7,622,329
- Issue date Nov 24, 2009
- Samsung Electro-Mechanics Co., Ltd.
- Yoong Oh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing package substrate with fine circuit pattern...
- Patent number 7,169,707
- Issue date Jan 30, 2007
- Samsung Electro-Mechanics Co., Ltd.
- Duck Young Maeng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20230335479
- Publication date Oct 19, 2023
- Samsung Electro-Mechanics Co., Ltd.
- Chan Hoon KO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20220181245
- Publication date Jun 9, 2022
- Samsung Electro-Mechanics Co., Ltd.
- Chan Hoon KO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE
- Publication number 20210066210
- Publication date Mar 4, 2021
- Samsung Electro-Mechanics Co., Ltd.
- Yoong OH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20210029825
- Publication date Jan 28, 2021
- Samsung Electro-Mechanics Co., Ltd.
- Young-Kuk KO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20200260580
- Publication date Aug 13, 2020
- Samsung Electro-Mechanics Co., Ltd.
- Young-Kuk KO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND PACKAGE STRUCTURE HAVING THE SAME
- Publication number 20200152566
- Publication date May 14, 2020
- Samsung Electro-Mechanics Co., Ltd.
- Yoong OH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20160135289
- Publication date May 12, 2016
- Samsung Electro-Mechanics Co., Ltd.
- Suk Hyeon CHO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20160128186
- Publication date May 5, 2016
- Samsung Electro-Mechanics Co., Ltd.
- Suk Hyeon CHO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING PRINTED CIRCUIT B...
- Publication number 20160088742
- Publication date Mar 24, 2016
- Samsung Electro-Mechanics Co., Ltd.
- Suk Hyeon CHO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CORE AND PRINTED CIRCUIT BOARD
- Publication number 20150373841
- Publication date Dec 24, 2015
- Samsung Electro-Mechanics Co., Ltd.
- Suk Hyeon CHO
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20150129289
- Publication date May 14, 2015
- Samsung Electro-Mechanics Co., Ltd.
- Gun Woo Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-LAYER TYPE CORELESS SUBSTRATE AND METHOD OF MANUFACTURING THE...
- Publication number 20140102766
- Publication date Apr 17, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Da Hee Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-LAYER TYPE PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING...
- Publication number 20140102767
- Publication date Apr 17, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Myung Sam Kang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER TYPE CORELESS SUBSTRATE AND METHOD OF MANUFACTURING THE...
- Publication number 20140027156
- Publication date Jan 30, 2014
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Ki Hwan Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CORELESS SUBTRATE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140014398
- Publication date Jan 16, 2014
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Ki Hwan Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDIUCTOR PACKAGE SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20120119358
- Publication date May 17, 2012
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Yoong OH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Printed circuit board and manufacturing method thereof
- Publication number 20120103662
- Publication date May 3, 2012
- Samsung Electro-Mechanics Co., Ltd.
- Chang Bo Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for manufacturing multi-layer printed circuit board
- Publication number 20120030942
- Publication date Feb 9, 2012
- Samsung Electro-Mechanics Co., Ltd.
- Yoong Oh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS AND METHOD FOR COATING
- Publication number 20120034386
- Publication date Feb 9, 2012
- Samsung Electro-Mechanics Co., Ltd.
- Yoong Oh
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
Apparatus for manufacturing printed circuit board
- Publication number 20110132546
- Publication date Jun 9, 2011
- Samsung Electro-Mechanics Co., Ltd.
- Yoong Oh
- B32 - LAYERED PRODUCTS
Information Patent Application
Core substrate and multilayer printed circuit board using paste bumps
- Publication number 20100025092
- Publication date Feb 4, 2010
- Samsung Electro Mechanics Co., Ltd.
- Yoong Oh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed circuit board using paste bump and manufacturing method the...
- Publication number 20090064497
- Publication date Mar 12, 2009
- Samsung Electro-Mechanics Co.
- Jee-Soo Mok
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Apparatus and method for manufacturing printed circuit board
- Publication number 20090049683
- Publication date Feb 26, 2009
- Samsung Electro-Mechanics Co., Ltd.
- Jee-Soo Mok
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Printed circuit board using paste bump and manufacturing method the...
- Publication number 20080283288
- Publication date Nov 20, 2008
- Samsung Electro-Mechanics Co., Ltd.
- Jee-Soo Mok
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Core substrate and multilayer printed circuit board using paste bum...
- Publication number 20070120253
- Publication date May 31, 2007
- Samsung Electro-Mechanics Co., Ltd.
- Yoong Oh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed circuit board using paste bump and manufacturing method the...
- Publication number 20070107934
- Publication date May 17, 2007
- Samsung Electro-Mechanics Co., Ltd.
- Jee-Soo Mok
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of manufacturing package substrate with fine circuit pattern...
- Publication number 20060046485
- Publication date Mar 2, 2006
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Duck Young Maeng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Person

Patents Grantslast 30 patents

Printed circuit board

Printed circuit board

Package substrate

Printed circuit board and package structure having the same

Printed circuit board

Printed circuit board and method of manufacturing the same

Printed circuit board and method of manufacturing printed circuit b...

Method for manufacturing multi-layer printed circuit board

Apparatus for manufacturing printed circuit board

Printed circuit board using paste bump and manufacturing method the...

Multilayer printed circuit board using paste bumps

Method for fabricating core substrate using paste bumps

Method of manufacturing package substrate with fine circuit pattern...

Patents Applicationslast 30 patents

PRINTED CIRCUIT BOARD

PRINTED CIRCUIT BOARD

PACKAGE SUBSTRATE

PRINTED CIRCUIT BOARD

PRINTED CIRCUIT BOARD

PRINTED CIRCUIT BOARD AND PACKAGE STRUCTURE HAVING THE SAME

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING PRINTED CIRCUIT B...

CORE AND PRINTED CIRCUIT BOARD

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

MULTI-LAYER TYPE CORELESS SUBSTRATE AND METHOD OF MANUFACTURING THE...

MULTI-LAYER TYPE PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING...

MULTILAYER TYPE CORELESS SUBSTRATE AND METHOD OF MANUFACTURING THE...

CORELESS SUBTRATE AND METHOD OF MANUFACTURING THE SAME

SEMICONDIUCTOR PACKAGE SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME

Printed circuit board and manufacturing method thereof

Method for manufacturing multi-layer printed circuit board

APPARATUS AND METHOD FOR COATING

Apparatus for manufacturing printed circuit board

Core substrate and multilayer printed circuit board using paste bumps

Printed circuit board using paste bump and manufacturing method the...

Apparatus and method for manufacturing printed circuit board

Printed circuit board using paste bump and manufacturing method the...

Core substrate and multilayer printed circuit board using paste bum...

Printed circuit board using paste bump and manufacturing method the...

Method of manufacturing package substrate with fine circuit pattern...