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Yoonha JUNG
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Suwon-si, KR
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Patents Grants
last 30 patents
Information
Patent Grant
Chip on film package and display apparatus including the same
Patent number
11,842,945
Issue date
Dec 12, 2023
Samsung Electronics Co., Ltd.
Jaemin Jung
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package including an image sensor chip and a method o...
Patent number
11,824,076
Issue date
Nov 21, 2023
Samsung Electronics Co., Ltd.
Yonghoe Cho
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package including an image sensor chip and a method o...
Patent number
11,335,719
Issue date
May 17, 2022
Samsung Electronics Co., Ltd.
Yonghoe Cho
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor packages having semiconductor chips disposed in openi...
Patent number
10,825,776
Issue date
Nov 3, 2020
Samsung Electronics Co., Ltd.
Yoonha Jung
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor packages having semiconductor chips disposed in openi...
Patent number
10,211,159
Issue date
Feb 19, 2019
Samsung Electronics Co., Ltd.
Yoonha Jung
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package
Patent number
9,659,852
Issue date
May 23, 2017
Samsung Electronics Co., Ltd.
Tongsuk Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor packages having semiconductor chips disposed in openi...
Patent number
9,425,156
Issue date
Aug 23, 2016
Samsung Electronics Co., Ltd.
Yoonha Jung
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and method of fabricating the same
Patent number
9,252,095
Issue date
Feb 2, 2016
Samsung Electronics Co., Ltd.
Jongkook Kim
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
SEMICONDUCTOR PACKAGE INCLUDING AN IMAGE SENSOR CHIP AND A METHOD O...
Publication number
20220254827
Publication date
Aug 11, 2022
Samsung Electronics Co., Ltd.
YONGHOE CHO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP ON FILM PACKAGE AND DISPLAY APPARATUS INCLUDING THE SAME
Publication number
20220139799
Publication date
May 5, 2022
Samsung Electronics Co., Ltd.
Jaemin Jung
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE INCLUDING AN IMAGE SENSOR CHIP AND A METHOD O...
Publication number
20210028217
Publication date
Jan 28, 2021
Samsung Electronics Co., Ltd.
YONGHOE CHO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGES HAVING SEMICONDUCTOR CHIPS DISPOSED IN OPENI...
Publication number
20190139899
Publication date
May 9, 2019
Samsung Electronics Co., Ltd.
Yoonha JUNG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGES HAVING SEMICONDUCTOR CHIPS DISPOSED IN OPENI...
Publication number
20160329285
Publication date
Nov 10, 2016
Samsung Electronics Co., Ltd.
Yoonha JUNG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THERMALLY ENHANCED PACKAGE-ON-PACKAGE STRUCTURE
Publication number
20160276308
Publication date
Sep 22, 2016
Samsung Electronics Co., Ltd.
Sunghwan MIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE
Publication number
20160172291
Publication date
Jun 16, 2016
Samsung Electronics Co., Ltd.
Tongsuk KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
Publication number
20160111347
Publication date
Apr 21, 2016
Jongkook KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF FABRICATING THE SAME
Publication number
20150035148
Publication date
Feb 5, 2015
Heeseok LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGES HAVING SEMICONDUCTOR CHIPS DISPOSED IN OPENI...
Publication number
20150028477
Publication date
Jan 29, 2015
Yoonha Jung
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
Publication number
20140008795
Publication date
Jan 9, 2014
Jongkook KIM
H01 - BASIC ELECTRIC ELEMENTS